XC3195-5PG223C

FPGA, 484 CLBS, 6500 GATES
Part Description

XC3100 Field Programmable Gate Array (FPGA) IC 176 94944 223-BCPGA

Quantity 935 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package223-CPGA (47.24x47.24)GradeCommercialOperating Temperature0°C – 70°C
Package / Case223-BCPGANumber of I/O176Voltage4.75 V - 5.25 V
Mounting MethodThrough HoleRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs484Number of Logic Elements/Cells484
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits94944

Overview of XC3195-5PG223C – Field Programmable Gate Array (FPGA), 223-BCPGA

The XC3195-5PG223C is a commercial-grade field programmable gate array (FPGA) IC offering moderate logic density and on-chip memory in a through-hole, 223-BCPGA package. It provides 484 logic elements, 94,944 bits of embedded RAM and 176 general-purpose I/O pins, making it suitable for commercial embedded applications that require customizable digital logic and significant I/O connectivity.

Engineered for 5 V systems, the device operates from a 4.75 V to 5.25 V supply and is specified for a commercial temperature range of 0 °C to 70 °C. The part is RoHS compliant and supplied in a 223-CPGA package (47.24x47.24).

Key Features

  • Logic Capacity  484 logic elements for implementing custom digital logic and control functions.
  • Embedded Memory  94,944 bits of on-chip RAM for data buffering, state storage and small lookup tables.
  • I/O Count  176 I/O pins to support broad peripheral and bus interfacing needs.
  • Power  Single-supply operation from 4.75 V to 5.25 V, compatible with 5 V system rails.
  • Package & Mounting  223-BCPGA package, supplier device package listed as 223-CPGA (47.24x47.24), in a through-hole mounting format.
  • Operating Range  Commercial temperature grade specified from 0 °C to 70 °C.
  • Environmental Compliance  RoHS compliant for regulated material requirements.

Unique Advantages

  • Balanced logic and memory  Combines 484 logic elements with 94,944 bits of embedded RAM to handle moderate-sized logic designs with local data storage.
  • High I/O density  176 I/O pins enable extensive connectivity for parallel buses, sensor arrays or mixed peripheral interfaces.
  • Through-hole package  223-BCPGA through-hole mounting simplifies prototyping, board rework and assembly processes where through-hole components are preferred.
  • 5 V system compatibility  Designed for operation on a 4.75 V to 5.25 V supply, allowing straightforward integration into legacy 5 V designs.
  • Commercial qualification  Specified for 0 °C to 70 °C operation, aligning with standard commercial electronics requirements.
  • RoHS compliance  Meets common environmental requirements for lead-free manufacturing and procurement.

Why Choose XC3195-5PG223C?

The XC3195-5PG223C positions itself as a practical FPGA option for commercial embedded designs that need a balance of logic, memory and extensive I/O in a through-hole package. Its combination of 484 logic elements, nearly 95k bits of on-chip RAM and 176 I/Os supports a wide range of customizable digital functions while maintaining compatibility with 5 V systems.

This device is suitable for engineering teams and procurement looking for a RoHS-compliant, commercial-grade FPGA in a 223-BCPGA footprint with through-hole mounting—providing a straightforward integration path for designs requiring moderate logic density and significant I/O capacity.

Request a quote or submit an inquiry to receive pricing and availability details for the XC3195-5PG223C.

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