XC3195-PG175CPH
| Part Description |
XC3100 Field Programmable Gate Array (FPGA) IC 144 94944 175-BCPGA |
|---|---|
| Quantity | 1,309 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 175-CPGA (42.16x42.16) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 175-BCPGA | Number of I/O | 144 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Through Hole | RoHS Compliance | Unknown | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | Vendor Undefined | Number of LABs/CLBs | 484 | Number of Logic Elements/Cells | 484 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 94944 |
Overview of XC3195-PG175CPH – XC3100 Field Programmable Gate Array (FPGA), 144 I/O, 175-BCPGA
The XC3195-PG175CPH is an XC3100-series field programmable gate array (FPGA) IC from AMD. It combines moderate logic capacity with embedded RAM and a high I/O count in a 175-BCPGA package for integration into commercial electronic systems.
With 484 logic elements, approximately 94.9 kbits of on-chip RAM, and 144 user I/O lines, this device targets applications that require configurable digital logic, dense I/O routing, and 5 V supply compatibility within a commercial temperature range (0 °C to 70 °C).
Key Features
- Core Logic 484 logic elements provide configurable fabric for implementing custom digital functions and control logic.
- Embedded Memory Approximately 94.9 kbits of on-chip RAM supports local data buffering, state storage, and small lookup tables.
- High I/O Count 144 user I/O pins enable broad interfacing options for parallel buses, control signals, and peripheral connections.
- Power Operates from a 4.75 V to 5.25 V supply, compatible with standard 5 V system power domains.
- Package 175-BCPGA (supplier package: 175-CPGA, 42.16 × 42.16 mm) provides a ball grid array footprint for board-level integration.
- Mounting Style Through-hole mounting allows for mechanical robustness and ease of prototyping or retrofit applications.
- Grade & Temperature Commercial grade device rated for 0 °C to 70 °C operation.
- Environmental Compliance RoHS compliant for regulatory alignment in standard commercial products.
Typical Applications
- Prototyping and Development Use the device’s programmable fabric and accessible I/O for evaluating custom logic and validating board-level designs.
- Custom Digital Control Implement control algorithms and finite-state machines using the 484 logic elements and on-chip RAM for state and data storage.
- I/O Expansion and Interface Glue 144 I/O connections provide flexibility to bridge subsystems, manage parallel interfaces, and consolidate glue logic.
- Embedded Systems Integration The 5 V supply compatibility and BCPGA package make the device suitable for integration into commercial embedded platforms within the specified temperature range.
Unique Advantages
- Balanced Logic and Memory: 484 logic elements paired with approximately 94.9 kbits of embedded RAM allow compact implementations of control and data-path functions without external memory.
- Extensive I/O: 144 I/O pins simplify board routing and reduce the need for additional interface chips.
- 5 V System Compatibility: Nominal 5 V operating range (4.75 V–5.25 V) eases integration into legacy and commercial power domains.
- Through-Hole Mounting Option: Through-hole package style supports robust mechanical attachment and straightforward prototyping or repairability.
- Commercial Temperature Rating: Specified operation from 0 °C to 70 °C fits standard commercial product environments.
- RoHS Compliant: Meets common environmental restrictions for lead-free manufacturing and assembly.
Why Choose XC3195-PG175CPH?
The XC3195-PG175CPH offers a compact, commercially rated FPGA solution that combines moderate logic density, substantial embedded RAM, and a high-count I/O footprint in a 175-BCPGA package. Its 5 V supply range and through-hole mounting make it practical for integration into a variety of commercial electronic designs where ease of prototyping and robust board attachment are priorities.
This device is well suited to engineers and procurement teams seeking a configurable logic device for custom control, interface consolidation, and prototype-to-production workflows within the specified temperature and electrical limits.
Request a quote or submit a pricing and availability inquiry to receive lead-time and ordering information for the XC3195-PG175CPH.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








