XC3195-PG175IPH

The XC3195-PG175IPH is a Field Programmable Gate Array (FPGA) IC from AMD, offered in a 175-BCPGA package. The device provides 484 logic elements, 144 I/O pins, and approximately 0.095 Mbits of embedded memory, supporting a range of industrial embedded designs.

Designed for industrial-grade applications, the FPGA operates from 4.5 V to 5.5 V and across an operating temperature range of -40 °C to 85 °C. Its through-hole mounting and 175-CPGA (42.16 × 42.16) supplier device package enable straightforward board integration where robust mechanical retention is required.

Key Features

• Logic Capacity 484 logic elements to implement custom digital functions and medium-complexity designs.
• Embedded Memory Approximately 0.095 Mbits (94,944 bits) of on-chip RAM for lookup tables, small data buffers, and state storage.
• I/O Density 144 input/output pins to support multiple parallel interfaces, GPIO, and peripheral connectivity.
• Power Single-supply operation from 4.5 V to 5.5 V, compatible with common 5 V embedded systems and legacy interfaces.
• Package and Mounting 175-BCPGA supplier device package (175-CPGA, 42.16 × 42.16) with through-hole mounting for secure mechanical attachment.
• Industrial Temperature Range Rated for -40 °C to 85 °C operation, suitable for industrial-environment deployments.
• RoHS Compliance RoHS status: Compliant.

Typical Applications

• Industrial Control Implements medium-complexity control logic and interface bridging in industrial automation equipment that requires industrial temperature ratings.
• I/O-Intensive Embedded Systems Supports designs needing a high number of parallel signals or custom peripheral glue logic thanks to 144 I/O pins.
• Legacy Interface Integration The 4.5 V to 5.5 V supply range and through-hole package make the device suitable for integrating with legacy 5 V systems and retrofitted hardware.

Unique Advantages

• Compact Logic Footprint: 484 logic elements provide a focused resource set for implementing dedicated control functions without excess overhead.
• On-Chip RAM Availability: Approximately 0.095 Mbits of embedded memory reduces the need for external RAM for small buffers and state machines.
• High I/O Count: 144 I/O pins simplify routing of parallel interfaces and allow multiple peripherals to be connected directly to the FPGA.
• Industrial-Grade Reliability: Rated for -40 °C to 85 °C operation to support deployment in industrial environments.
• Robust Mechanical Mounting: Through-hole 175-BCPGA package provides a mechanically secure attachment for boards exposed to vibration or handling.
• RoHS Compliant: Conforms to RoHS requirements for reduced hazardous substances in manufacturing.

Why Choose XC3195-PG175IPH?

The XC3195-PG175IPH offers a balanced combination of logic resources, on-chip memory, and a high I/O count in an industrial-grade, through-hole 175-BCPGA package. Its 4.5 V–5.5 V supply compatibility and wide operating temperature range make it a practical choice for embedded systems and industrial applications that require reliable, medium-scale programmable logic.

This FPGA is well suited to engineers and procurement teams seeking a compact, mechanically robust programmable device that simplifies integration with existing 5 V platforms while providing sufficient logic and memory for control, interface, and glue-logic tasks.

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