XC3195-PQ208CPH
| Part Description |
XC3100 Field Programmable Gate Array (FPGA) IC 176 94944 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 1,107 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 176 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | Vendor Undefined | Number of LABs/CLBs | 484 | Number of Logic Elements/Cells | 484 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 94944 |
Overview of XC3195-PQ208CPH – Field Programmable Gate Array (FPGA) IC, 208-BFQFP Exposed Pad
The XC3195-PQ208CPH is a Field Programmable Gate Array (FPGA) device from the XC3100 family offered in a 208-BFQFP exposed pad package. It provides 484 logic elements, approximately 0.095 Mbits (94,944 bits) of on-chip RAM and 176 user I/O pins for mid-density programmable logic designs.
Engineered for surface-mount assembly and commercial-grade applications, the device operates from a 4.75 V to 5.25 V supply and across a 0 °C to 70 °C temperature range, with RoHS compliance for environmental assurance.
Key Features
- Core Logic 484 logic elements for implementing custom logic, glue-logic and moderate combinational/sequential functions.
- Embedded Memory Approximately 0.095 Mbits (94,944 bits) of on-chip RAM to support buffering, small data tables and state storage.
- I/O Capacity 176 user I/O pins to interface with peripheral devices, buses and external logic.
- Power Single-supply operation from 4.75 V to 5.25 V to match legacy and common system rails.
- Package & Mounting 208-BFQFP exposed pad package (supplier package: 208-PQFP, 28×28) designed for surface-mount assembly and thermal/power handling via the exposed pad.
- Operating Conditions Commercial grade operation specified from 0 °C to 70 °C.
- Environmental RoHS compliant for restricted substance adherence.
Unique Advantages
- Balanced logic and memory Combines 484 logic elements with nearly 95kbits of on-chip RAM to support control logic plus modest data storage without external RAM.
- High I/O count in a compact package 176 I/O signals delivered in a 208-pin BFQFP footprint, enabling dense I/O layouts while maintaining a standard SMT form factor.
- 5 V supply compatibility Designed for systems using a 5 V supply range (4.75–5.25 V), easing integration into existing 5 V boards and legacy interfaces.
- Exposed pad thermal path Exposed pad package option assists thermal dissipation for more reliable operation in compact assemblies.
- Commercial-grade suitability Specified operation from 0 °C to 70 °C for general-purpose electronics and consumer applications.
- Regulatory readiness RoHS compliance supports environmental and supply-chain requirements.
Why Choose XC3195-PQ208CPH?
The XC3195-PQ208CPH positions itself as a compact, mid-density FPGA option delivering a practical combination of logic, embedded RAM and high I/O count in a 208-BFQFP exposed pad package. Its 5 V supply compatibility and surface-mount form factor make it suitable for commercial electronic designs that require programmable logic with significant I/O and local memory resources.
This device is well suited to designers and procurement teams seeking a RoHS-compliant, commercially graded FPGA that balances integration, I/O capacity and on-chip memory for control, interfacing and customization tasks. The exposed pad package further supports thermal management in dense assemblies.
Request a quote or contact sales to obtain pricing, availability and order information for the XC3195-PQ208CPH.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








