XC3195-PQ208CPH

XC3195 - XC3000 SERIES FIELD PRO
Part Description

XC3100 Field Programmable Gate Array (FPGA) IC 176 94944 208-BFQFP Exposed Pad

Quantity 1,107 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFP Exposed PadNumber of I/O176Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Affected
Moisture Sensitivity LevelVendor UndefinedNumber of LABs/CLBs484Number of Logic Elements/Cells484
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits94944

Overview of XC3195-PQ208CPH – Field Programmable Gate Array (FPGA) IC, 208-BFQFP Exposed Pad

The XC3195-PQ208CPH is a Field Programmable Gate Array (FPGA) device from the XC3100 family offered in a 208-BFQFP exposed pad package. It provides 484 logic elements, approximately 0.095 Mbits (94,944 bits) of on-chip RAM and 176 user I/O pins for mid-density programmable logic designs.

Engineered for surface-mount assembly and commercial-grade applications, the device operates from a 4.75 V to 5.25 V supply and across a 0 °C to 70 °C temperature range, with RoHS compliance for environmental assurance.

Key Features

  • Core Logic  484 logic elements for implementing custom logic, glue-logic and moderate combinational/sequential functions.
  • Embedded Memory  Approximately 0.095 Mbits (94,944 bits) of on-chip RAM to support buffering, small data tables and state storage.
  • I/O Capacity  176 user I/O pins to interface with peripheral devices, buses and external logic.
  • Power  Single-supply operation from 4.75 V to 5.25 V to match legacy and common system rails.
  • Package & Mounting  208-BFQFP exposed pad package (supplier package: 208-PQFP, 28×28) designed for surface-mount assembly and thermal/power handling via the exposed pad.
  • Operating Conditions  Commercial grade operation specified from 0 °C to 70 °C.
  • Environmental  RoHS compliant for restricted substance adherence.

Unique Advantages

  • Balanced logic and memory  Combines 484 logic elements with nearly 95kbits of on-chip RAM to support control logic plus modest data storage without external RAM.
  • High I/O count in a compact package  176 I/O signals delivered in a 208-pin BFQFP footprint, enabling dense I/O layouts while maintaining a standard SMT form factor.
  • 5 V supply compatibility  Designed for systems using a 5 V supply range (4.75–5.25 V), easing integration into existing 5 V boards and legacy interfaces.
  • Exposed pad thermal path  Exposed pad package option assists thermal dissipation for more reliable operation in compact assemblies.
  • Commercial-grade suitability  Specified operation from 0 °C to 70 °C for general-purpose electronics and consumer applications.
  • Regulatory readiness  RoHS compliance supports environmental and supply-chain requirements.

Why Choose XC3195-PQ208CPH?

The XC3195-PQ208CPH positions itself as a compact, mid-density FPGA option delivering a practical combination of logic, embedded RAM and high I/O count in a 208-BFQFP exposed pad package. Its 5 V supply compatibility and surface-mount form factor make it suitable for commercial electronic designs that require programmable logic with significant I/O and local memory resources.

This device is well suited to designers and procurement teams seeking a RoHS-compliant, commercially graded FPGA that balances integration, I/O capacity and on-chip memory for control, interfacing and customization tasks. The exposed pad package further supports thermal management in dense assemblies.

Request a quote or contact sales to obtain pricing, availability and order information for the XC3195-PQ208CPH.

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