XC3S1000-4FG320C

The XC3S1000-4FG320C is a Spartan®-3 field programmable gate array (FPGA) IC from AMD designed for commercial-grade programmable logic applications. It delivers a balance of logic capacity, on-chip memory and a high I/O count in a compact 320‑BGA (320‑FBGA, 19×19) surface-mount package.

With a supply voltage range of 1.14 V to 1.26 V, commercial temperature rating (0 °C to 85 °C) and RoHS compliance, this device targets designs that require moderate embedded memory, significant I/O connectivity and a predictable commercial operating environment.

Key Features

• Logic Capacity  Provides 17,280 logic elements, enabling implementation of moderate-complexity digital functions within a single FPGA.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 total bits) for data buffering, FIFOs and small lookup tables.
• I/O Count  221 available I/O pins to support multiple interfaces and external peripherals directly from the device.
• Gate Equivalent  Rated at 1,000,000 gates to express device scale for system partitioning and capacity planning.
• Package & Mounting  320‑BGA (320‑FBGA, 19×19) surface-mount package provides a compact footprint for board-level integration.
• Power & Temperature  Operates from 1.14 V to 1.26 V and is specified for commercial temperature operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Use as a programmable glue-logic element or custom controller where a balance of logic resources and I/O is required within a commercial temperature range.
• Interface Bridging and Protocol Conversion  Leverage the device’s 221 I/Os for consolidating multiple parallel and serial interfaces on a single FPGA.
• Prototyping and Development  Suitable for validating custom digital logic and proof-of-concept designs that require reprogrammable hardware capacity and on-chip RAM.

Unique Advantages

• High Logic Density: 17,280 logic elements provide room to integrate multiple functions that would otherwise require several discrete ICs.
• Significant On‑Chip Memory: Approximately 0.44 Mbits of embedded RAM supports buffering and local data storage without external memory.
• Extensive I/O Connectivity: 221 I/Os simplify board-level routing for multi-interface designs and reduce reliance on external translators.
• Compact BGA Packaging: The 320‑FBGA (19×19) surface-mount package enables a small PCB footprint while maintaining a high pin count.
• Commercial Temperature and RoHS Compliance: Specified for 0 °C to 85 °C operation and RoHS compliant for commercial product deployments.

Why Choose XC3S1000-4FG320C?

The XC3S1000-4FG320C positions itself as a practical choice for commercial designs that need a balance of programmable logic, on-chip memory and broad I/O in a compact package. Its combination of 17,280 logic elements, approximately 0.44 Mbits of embedded RAM and 221 I/Os makes it suitable for consolidating functions and simplifying board-level designs.

Backed by AMD as the manufacturer and offered in a RoHS-compliant, commercially graded package, this Spartan®-3 device provides predictable electrical and thermal characteristics for production designs that require reprogrammable hardware capacity and reliable supply-voltage operation.

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