XC3S1000-4FG320I

The XC3S1000-4FG320I is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD designed for configurable digital logic implementations. It combines 17,280 logic elements with integrated on-chip memory and broad I/O capability to support industrial applications requiring flexible, reprogrammable hardware.

This device is offered in a 320-ball BGA package with industrial-grade temperature ratings and RoHS compliance, making it suitable for embedded control and I/O-dense system designs that demand reliability across a wide operating range.

Key Features

• Core Logic 17,280 logic elements providing a programmable fabric capable of implementing custom digital functions; approximately 1,000,000 equivalent gates.
• Embedded Memory Approximately 0.42 Mbits (442,368 bits) of on-chip RAM for buffering, data storage, and state-machine implementations.
• I/O Capacity 221 user I/O pins to support a wide range of external interfaces and parallel/serial connectivity.
• Package and Mounting Surface-mount 320-ball FBGA package (19 × 19) offering a compact footprint for high-density board designs.
• Power Core supply range from 1.14 V to 1.26 V to match system power-rail requirements.
• Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control and Automation The industrial-grade temperature range and flexible logic make it suitable for control logic, protocol bridging, and sensor interfacing in factory and process environments.
• Embedded System Prototyping Reprogrammable logic and sizeable on-chip RAM enable rapid development and iteration of custom hardware functions.
• I/O-Intensive Interface Design With 221 I/O pins, the device supports designs that require multiple parallel buses, custom peripheral interfaces, or aggregated serial links.

Unique Advantages

• High Logical Capacity: 17,280 logic elements and roughly 1,000,000 gates provide substantial programmable resources for complex designs.
• On-Chip Memory for Data Handling: Approximately 0.42 Mbits of embedded RAM reduces dependency on external memory for buffering and small data stores.
• Extensive I/O: 221 I/O pins simplify integration with multiple peripherals and external systems, reducing the need for additional interface components.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to meet environmental demands typical of industrial deployments.
• Compact Packaging: 320-FBGA (19×19) package supports space-constrained board layouts while enabling high pin density.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XC3S1000-4FG320I?

The XC3S1000-4FG320I positions itself as a robust, industrial-grade FPGA option for engineers seeking substantial programmable logic, on-chip memory, and extensive I/O in a compact BGA package. Its combination of 17,280 logic elements, approximately 0.42 Mbits of embedded RAM, and 221 I/O pins provides design flexibility for control systems, interface bridging, and embedded hardware prototyping.

Manufactured by AMD and supplied in a RoHS-compliant 320-FBGA package with an industrial temperature rating, this device is suitable for teams prioritizing reliable, reprogrammable hardware that can scale across multiple embedded and industrial deployments.

Request a quote or submit a purchase inquiry to learn more about availability and lead times for the XC3S1000-4FG320I.