XC3S1000-4FG676I

The XC3S1000-4FG676I is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD packaged in a 676-BGA surface-mount footprint. It combines a sizeable configurable logic fabric with on-chip memory and a high I/O count for embedded and industrial applications.

Key device attributes include 1,920 CLBs, 17,280 logic elements, approximately 0.42 Mbits of embedded memory, 391 user I/Os, a core voltage range of 1.14 V to 1.26 V, and an operating temperature range of -40 °C to 100 °C.

Key Features

• Core Logic 1,920 CLBs and 17,280 logic elements provide the programmable fabric to implement custom digital functions and control logic.
• Embedded Memory Approximately 0.42 Mbits of on-chip RAM to support buffering, small data storage and state machines.
• I/O Capacity 391 available I/Os for interfacing with peripherals, sensors, and external logic.
• Gate Density Approximately 1,000,000 gates for mapping moderate-complexity designs.
• Power Core voltage supply range from 1.14 V to 1.26 V to match standard low-voltage power domains.
• Package & Mounting 676-BGA package (supplier device package: 676-FBGA, 27×27) designed for surface-mount assembly and compact board layouts.
• Thermal & Grade Industrial-grade operation from -40 °C to 100 °C for deployment in temperature-demanding environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Custom digital logic and prototyping — Implement application-specific logic using 17,280 logic elements and 1,920 CLBs for proofs-of-concept and production designs.
• I/O-intensive interface bridging — Use 391 I/Os to connect multiple peripherals, buses, and external devices.
• Memory-assisted control functions — Leverage approximately 0.42 Mbits of embedded memory for buffering, FIFOs, and small local data stores.
• Industrial control and automation — Industrial temperature range and RoHS compliance support deployment in factory-floor and industrial equipment applications.

Unique Advantages

• Balanced logic and memory — The combination of 17,280 logic elements and ~0.42 Mbits of embedded RAM supports both control logic and modest data buffering on a single device.
• High I/O density — 391 I/Os reduce the need for additional interface components, simplifying board-level integration.
• Compact BGA footprint — 676-FBGA (27×27) package enables a high-density board layout while supporting surface-mount assembly processes.
• Industrial temperature tolerance — Rated for -40 °C to 100 °C operation for robust performance in challenging environments.
• Low-voltage core operation — 1.14 V to 1.26 V supply range aligns with modern low-power system domains.
• Regulatory readiness — RoHS compliance eases environmental and end-product regulatory considerations.

Why Choose XC3S1000-4FG676I?

The XC3S1000-4FG676I offers a practical balance of programmable logic, embedded memory and I/O capacity in an industrial-grade, RoHS-compliant package. Its 1,920 CLBs and 17,280 logic elements make it well suited to designs that require configurable logic with moderate on-chip resources and substantial I/O connectivity.

This Spartan®-3 FPGA is aimed at engineers and procurement teams looking for a compact, surface-mount FPGA that supports industrial temperature ranges and standard BGA packaging for streamlined integration into production systems.

Request a quote for the XC3S1000-4FG676I today to receive pricing and availability information.