XC3S1000-4FGG320I

The XC3S1000-4FGG320I is an AMD Spartan®-3 Field Programmable Gate Array (FPGA) supplied in a 320-BGA package. It combines a dense logic fabric with embedded memory and a broad I/O count to support configurable digital designs for industrial applications.

With 17,280 logic elements, approximately 0.44 Mbits of on-chip RAM and 221 user I/Os, this device targets designs that require reprogrammable logic, flexible I/O routing and operation across an extended temperature range.

Key Features

• Core & Logic  1920 CLBs (Configurable Logic Blocks) delivering 17,280 logic elements to implement custom digital functions and state machines.
• Embedded Memory  Approximately 0.44 Mbits (442,368 bits) of on-chip RAM for FIFOs, buffers and local data storage.
• I/O Density  221 user I/O pins provide connectivity for parallel interfaces, control signals and peripheral expansion.
• Gate Count  Around 1,000,000 gates for medium-complexity logic integration within a single device.
• Package & Mounting  320-BGA (supplier package: 320-FBGA, 19×19) in a surface-mount form factor for compact PCB implementations.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power-rail requirements.
• Temperature & Grade  Industrial-grade device rated for operation from –40°C to 100°C, suitable for temperature-challenging environments.
• Compliance  RoHS compliant, meeting lead-free material requirements.

Typical Applications

• Industrial Control  Implement programmable control logic, sequencing and I/O aggregation where extended temperature range and industrial grading are required.
• Communications & Networking  Support custom protocol handling and I/O interfacing using available logic and abundant user I/Os.
• Prototyping & Custom Logic  Rapidly iterate hardware designs and validate algorithms with reconfigurable logic in a compact BGA package.
• Data Acquisition & Signal Conditioning  Local buffering and preprocessing using embedded RAM and configurable logic for sensor and measurement systems.

Unique Advantages

• Balanced integration:  Combines a substantial logic element count with embedded memory and high I/O density to consolidate multiple functions into a single FPGA.
• Industrial readiness:  Rated for –40°C to 100°C operation and supplied in a robust BGA package for deployment in industrial environments.
• Compact footprint:  320-FBGA (19×19) packaging and surface-mount mounting simplify board-level integration while saving PCB area.
• Flexible power interface:  Core voltage range of 1.14 V–1.26 V supports integration with modern power architectures.
• Standards-compliant materials:  RoHS compliance eases regulatory and manufacturing considerations for lead-free assemblies.

Why Choose XC3S1000-4FGG320I?

The XC3S1000-4FGG320I positions itself as a versatile FPGA option for engineers needing medium-complexity programmable logic, modest embedded memory and a high I/O count in an industrial-grade package. Its combination of 17,280 logic elements, approximately 0.44 Mbits of on-chip RAM and 221 I/Os enables consolidation of control, interfacing and preprocessing tasks into a single device.

This part is suited for teams designing industrial and embedded systems that require reconfigurability, reliable operation across a wide temperature range and straightforward PCB integration via a 320-BGA surface-mount package. Its measurable specifications offer clear criteria for system partitioning, BOM reduction and long-term maintainability.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the XC3S1000-4FGG320I and start integrating this Spartan®-3 FPGA into your next design.