XC3S1000-4FGG676C

The XC3S1000-4FGG676C is an AMD Spartan®-3 field programmable gate array (FPGA) provided in a 676-ball BGA package. It delivers 17,280 logic elements, approximately 0.44 Mbits of embedded RAM, and 391 general-purpose I/O, making it suitable for commercial FPGA applications that require a balance of logic capacity, on-chip memory, and I/O density.

This device operates with a core supply voltage between 1.14 V and 1.26 V, is surface-mountable in a 676-FBGA (27 × 27) footprint, and is specified for commercial temperature operation from 0 °C to 85 °C. The part is RoHS compliant.

Key Features

• Core and Logic Provides 17,280 logic elements, enabling implementation of sizeable custom digital logic functions within the Spartan-3 architecture.
• Embedded Memory Approximately 0.44 Mbits of on-chip RAM (442,368 total bits) for buffering, state storage, and small data tables integrated on the device.
• I/O and Connectivity 391 I/O pins support a wide range of external interfacing requirements and system connectivity options.
• Gate Count Equivalent to 1,000,000 gates, allowing for complex logic structures and feature integration on a single IC.
• Power Core voltage range from 1.14 V to 1.26 V to match low-voltage FPGA system designs.
• Package and Mounting 676-ball FBGA (27 × 27) package, surface-mountable for standard PCB assembly processes.
• Operating Conditions and Compliance Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental requirements.

Unique Advantages

• Substantial logic capacity: 17,280 logic elements enable consolidation of multiple functions into a single FPGA, reducing system complexity.
• On-chip memory availability: Approximately 0.44 Mbits of embedded RAM supports data buffering and local storage without external memory.
• High I/O count: 391 I/O pins provide flexibility for interfacing with multiple peripherals and high-pin-count subsystems.
• Compact BGA package: 676-FBGA (27 × 27) offers a dense footprint for space-constrained PCB layouts while supporting surface-mount assembly.
• Low-voltage core operation: 1.14 V to 1.26 V supply range aligns with modern low-voltage system designs.
• Commercial-grade qualification and RoHS compliance: Specified for 0 °C to 85 °C operation and compliant with RoHS requirements for regulatory and environmental considerations.

Why Choose XC3S1000-4FGG676C?

The XC3S1000-4FGG676C combines a sizable logic fabric, embedded RAM, and a high I/O count in a compact 676-BGA package, delivering a balanced solution for commercial FPGA designs that require integrated logic, memory, and connectivity. Its low-voltage core and surface-mount FBGA footprint make it appropriate for modern PCB assemblies where board space and power efficiency are considerations.

Manufactured by AMD and supported by Spartan-3 family documentation, this device is suited to designers seeking a well-documented, commercially rated FPGA option with verifiable specifications for integration into a broad range of electronic systems.

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