XC3S1000-4FTG256C

The XC3S1000-4FTG256C is a Spartan®-3 field programmable gate array (FPGA) IC supplied in a 256-LBGA package. It provides a commercial-grade programmable fabric with 17,280 logic elements, approximately 0.44 Mbits of embedded memory, and 173 user I/O pins to support a wide range of custom digital designs.

Designed for surface-mount assembly, this device targets commercial applications needing flexible hardware implementation with a 1.14 V to 1.26 V core voltage range and an ambient operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 17,280 logic elements supporting up to 1,000,000 gates for implementing custom digital logic and control functions.
• Embedded Memory Approximately 0.44 Mbits of on-chip RAM to store configuration data, frame buffers, or temporary datasets.
• I/O Capacity 173 general-purpose I/O pins for interfacing with peripherals, sensors, and external logic.
• Power Core supply voltage range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Package & Mounting 256-LBGA package (supplier package: 256-FTBGA, 17×17) in a surface-mount form factor suitable for modern PCB assembly.
• Operating Conditions Commercial-grade operating temperature range of 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

• Embedded Systems — Implement custom control logic, timing-critical state machines, and peripheral interfaces in compact commercial products.
• Prototyping & Development — Rapidly evaluate and iterate digital designs where reconfigurable logic and moderate on-chip memory are required.
• Interface & Glue Logic — Bridge disparate buses and adapt signal protocols using abundant I/O and programmable logic.

Unique Advantages

• High logic capacity: 17,280 logic elements and 1,000,000 gates enable substantial custom digital functionality without external processors.
• Integrated memory: Approximately 0.44 Mbits of embedded RAM reduces dependency on external memory for many buffering and temporary storage needs.
• Generous I/O count: 173 I/O pins simplify board-level integration with peripherals, sensors, and external logic devices.
• Commercial readiness: 0 °C to 85 °C operating range and RoHS compliance align this device to standard commercial product requirements.
• Compact surface-mount package: 256-LBGA (256-FTBGA, 17×17) supports dense PCB designs and common assembly flows.

Why Choose XC3S1000-4FTG256C?

The XC3S1000-4FTG256C combines a sizable programmable fabric with embedded memory and a high I/O count in a compact 256-LBGA package, making it suitable for commercial electronic designs that require flexible hardware implementation and moderate on-chip resources. Its defined voltage and temperature ranges, together with RoHS compliance, support consistent integration into production systems.

This device is a practical option for engineers and procurement teams looking for a commercially graded Spartan®-3 FPGA offering a balance of logic capacity, memory, and I/O in a surface-mount form factor.

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