XC3S1000-4FTG256I

The XC3S1000-4FTG256I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 256-LBGA package. It provides a programmable hardware platform with 17,280 logic elements, approximately 0.44 Mbits of embedded memory, and up to 173 I/O pins for custom digital designs and system integration.

Designed for industrial applications, this surface-mount FPGA operates over an industrial temperature range and supports a core supply voltage range of 1.14 V to 1.26 V, offering a compact, rugged option where dense programmable logic and reliable operation are required.

Key Features

• Programmable Logic — 17,280 logic elements enabling complex custom digital functions and parallel processing within a single device.
• Embedded Memory — Approximately 0.44 Mbits of on-chip RAM for buffering, state machines, and local data storage.
• I/O Capacity — 173 user I/O pins to support multiple external interfaces and high pin-count system requirements.
• Logic Resource Count — Provides the equivalent of 1,000,000 gates for mid-range logic integration and system consolidation.
• Power — Core supply voltage range of 1.14 V to 1.26 V for defined power planning and supply design.
• Package and Mounting — 256-LBGA package (supplier device package: 256-FTBGA, 17×17) in a surface-mount form factor for compact PCB layouts.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for demanding environments.
• Standards Compliance — RoHS compliant to support environmentally sensitive product builds.

Typical Applications

• Industrial Control — Implement custom control logic and real-time processing using the device’s logic capacity and industrial temperature rating.
• Embedded Systems — Integrate mid-range programmable logic, on-chip RAM, and up to 173 I/O for compact embedded designs.
• Prototyping and Development — Use the FPGA’s programmable resources and I/O density to validate digital designs before committing to ASICs or fixed-function hardware.

Unique Advantages

• High Logic Density: 17,280 logic elements and 1,000,000 gates enable substantial functionality consolidation into a single device, reducing board-level BOM.
• Balanced Memory and I/O: Approximately 0.44 Mbits of embedded RAM combined with 173 I/O pins supports diverse buffering and interfacing requirements without external memory.
• Industrial Reliability: Industrial-grade operating range (−40 °C to 100 °C) and surface-mount packaging support deployment in harsh environments.
• Compact, Serviceable Package: 256-LBGA / 256-FTBGA (17×17) package provides a small footprint for space-constrained PCBs while enabling high pin density.
• Regulatory Compatibility: RoHS compliance aids in meeting environmental and regulatory requirements for product assembly.

Why Choose XC3S1000-4FTG256I?

The XC3S1000-4FTG256I positions itself as a versatile mid-range FPGA option, combining substantial logic resources, on-chip memory, and a high I/O count in a compact 256-LBGA package. Its industrial temperature rating and defined core voltage range make it suitable for designs that require reliable operation across a wide range of conditions.

This device is well suited for engineers and product teams who need to consolidate digital functions, prototype complex systems, or deploy programmable logic in space-constrained, industrial applications—delivering measurable integration and design flexibility from a proven FPGA family.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S1000-4FTG256I.