XC3S1000-4FT256I

The XC3S1000-4FT256I is a Spartan®-3 FPGA from AMD, delivering programmable logic capacity and on-chip resources in a compact 256-LBGA package. It integrates 17,280 logic elements and approximately 0.44 Mbits of embedded memory with 173 user I/O pins and a gate count of 1,000,000.

Designed for industrial use, this surface-mount device operates across a -40 °C to 100 °C temperature range and runs from a 1.14 V to 1.26 V supply, providing a reliable platform for industrial-grade programmable logic implementations.

Key Features

• Core Logic — 17,280 logic elements provide substantial programmable capacity for custom digital functions and control logic.
• Embedded Memory — Approximately 0.44 Mbits of on-chip RAM for data buffering, state machines, and small data storage needs.
• I/O and Gate Count — 173 general-purpose I/O pins and a 1,000,000-gate equivalent count to support moderate interface and glue-logic requirements.
• Power Supply — Operates from a 1.14 V to 1.26 V core supply for integration into low-voltage systems.
• Package and Mounting — 256-LBGA (supplier package: 256-FTBGA 17×17), surface-mount mounting for compact board layouts.
• Temperature and Grade — Industrial grade device rated for operation from -40 °C to 100 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement custom control logic and interface bridging where industrial temperature operation and robust I/O counts are required.
• Embedded Systems — Use as a programmable logic engine for embedded designs that need moderate logic capacity and on-chip RAM.
• Data Interface and Glue Logic — Provide protocol conversion, bus interfacing, and timing control leveraging the available I/O and gate resources.
• Prototyping and Development — Rapidly iterate digital designs on a field-programmable device with a compact BGA footprint.

Unique Advantages

• Substantial Logic Capacity: 17,280 logic elements enable complex combinational and sequential designs without immediate need for external logic.
• Embedded Memory On-Board: Approximately 0.44 Mbits of RAM supports buffering, FIFOs, and small data structures directly on the FPGA.
• High I/O Count: 173 user I/O pins allow integration with multiple peripherals and interfaces on a single device.
• Industrial Operating Range: Rated from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact, Surface-Mount Package: 256-LBGA (256-FTBGA 17×17) supports space-constrained PCB designs while maintaining connectivity.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC3S1000-4FT256I?

The XC3S1000-4FT256I combines a balanced mix of logic density, embedded memory, and I/O in a compact industrial-grade package, making it suitable for engineers who need programmable logic with reliable temperature performance and low-voltage operation. As an AMD Spartan®-3 device, it delivers the specific, verifiable resource set—17,280 logic elements, ~0.44 Mbits embedded RAM, 173 I/O—in a 256-LBGA footprint.

This part is a practical choice for designs that require moderate programmable capacity with industrial temperature tolerance, compact mounting, and RoHS compliance. It fits applications where integration, predictable supply requirements (1.14 V–1.26 V), and a clear resource profile are priorities.

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