XC3S1000-5FG320C

The XC3S1000-5FG320C is a Spartan®-3 field programmable gate array (FPGA) from AMD, supplied in a 320-BGA package. It provides a balance of programmable logic, on-chip RAM and I/O density for commercial embedded designs.

With 17,280 logic elements, approximately 0.44 Mbits of embedded memory and 221 user I/O, this device targets designs that require moderate logic capacity and flexible interfacing in a compact surface-mount BGA package.

Key Features

• Core Logic  17,280 logic elements and 1,920 CLBs deliver programmable logic resources suitable for mid-range FPGA tasks.
• Embedded Memory  Total on-chip RAM of 442,368 bits (approximately 0.44 Mbits) for buffering, lookup tables and small data storage needs.
• I/O Capacity  221 available I/O pins support a wide range of external interfaces and parallel connectivity options.
• Gate Count  Approximately 1,000,000 gates provide a practical metric for overall device complexity and integration.
• Power  Core supply voltage range of 1.14 V to 1.26 V, enabling predictable power planning for the FPGA core.
• Package & Mounting  320-BGA (supplier package: 320-FBGA 19×19) in a surface-mount form factor for compact board-level integration.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C suitable for general-purpose electronics.
• Compliance  RoHS compliant to support environmental and manufacturing requirements.

Typical Applications

• Interface and glue logic  Use the device’s 221 I/O and configurable logic to implement protocol bridging and board-level interface functions.
• Embedded control and state machines  Leverage 17,280 logic elements to implement control logic, sequencing and custom finite state machines.
• Data buffering and small memory functions  On-chip RAM (approximately 0.44 Mbits) supports packet buffering, FIFOs and LUT-based storage.

Unique Advantages

• Balanced logic and memory  Combines 17,280 logic elements with roughly 0.44 Mbits of embedded RAM for mid-range integration without external memory in many designs.
• High I/O count  221 I/O pins help reduce the need for additional I/O expanders and simplify board-level routing for multi-peripheral systems.
• Compact BGA footprint  320-BGA packaging lets you fit substantial programmable logic into space-constrained PCBs while retaining surface-mount assembly compatibility.
• Predictable power requirements  A defined core voltage range (1.14 V–1.26 V) supports straightforward power supply design and validation.
• Standards-friendly  RoHS compliance supports environmentally conscious manufacturing and regulatory needs.

Why Choose XC3S1000-5FG320C?

The XC3S1000-5FG320C provides a practical combination of logic density, embedded memory and I/O capacity in a compact 320-BGA package from AMD. Its feature set suits engineering teams building commercial-grade embedded systems that require configurable logic and flexible interfacing without excessive board area or external components.

This device is well suited to designers seeking a scalable FPGA option that balances integration and manufacturability, with clear electrical and thermal parameters for predictable system design and qualification.

If you would like pricing, availability or a formal quote for the XC3S1000-5FG320C, request a quote or submit your procurement details and our team will respond promptly.