XC3S1000-5FGG320C

The XC3S1000-5FGG320C is a Spartan®-3 Field Programmable Gate Array (FPGA) provided in a 320-BGA surface-mount package. It integrates 17,280 logic elements, approximately 0.44 Mbits of embedded memory, and 221 user I/O pins to address a range of commercial programmable-logic requirements.

With a 1.14 V to 1.26 V core supply range, RoHS compliance, and a commercial operating range of 0 °C to 85 °C, this device is suited for board-level integration where a compact BGA footprint and mid-range programmable density are required.

Key Features

• Logic Capacity  Provides 17,280 logic elements supporting mid-range programmable logic integration for custom digital functions.
• Embedded Memory  Includes a total of 442,368 bits of on-chip RAM (approximately 0.44 Mbits) for data buffering, small FIFOs, and state storage.
• I/O Density  Offers 221 user I/O pins to support multiple parallel interfaces and board-level signal routing.
• Gate Count  Specified at 1,000,000 gates, useful for quantifying device scale in system partitioning and resource planning.
• Package & Mounting  320-BGA package (320-FBGA, 19×19) in a surface-mount format for compact, board-level integration.
• Power  Core supply requirement from 1.14 V to 1.26 V to match power-rail planning on target PCB designs.
• Operating Environment  Commercial-grade operation over 0 °C to 85 °C for standard ambient environments.
• Regulatory  RoHS compliant to support lead-free assembly processes and regulatory requirements.

Typical Applications

• Commercial System Integration  Use in commercial electronic designs that require programmable logic with up to 17,280 logic elements and 221 I/Os for custom control and interface tasks.
• Board-Level Compact Designs  Ideal where a 320-BGA surface-mount package is needed to conserve PCB area while providing significant gate and I/O resources.
• Power-Constrained Designs  Applicable to systems that operate with a 1.14 V–1.26 V core rail and require on-chip RAM for buffering and state retention within a commercial temperature range.

Unique Advantages

• Balanced Logic and Memory:  17,280 logic elements combined with approximately 0.44 Mbits of embedded RAM offers a practical balance for mid-complexity functions without external memory for small buffers.
• High I/O Count:  221 user I/O pins enable multiple parallel interfaces and flexible board-level connectivity, reducing the need for external I/O expanders.
• Compact BGA Footprint:  320-FBGA (19×19) package provides a dense, surface-mount solution that saves PCB area and supports modern board layouts.
• Commercial Temperature Range:  Specified 0 °C to 85 °C operation aligns with standard commercial deployments and typical environmental conditions for consumer and industrial-adjacent equipment.
• RoHS Compliant:  Supports lead-free manufacturing workflows and compliance requirements for modern electronics production.
• Defined Power Envelope:  Clear core voltage range (1.14 V–1.26 V) simplifies power supply design and rail specification on the host board.

Why Choose XC3S1000-5FGG320C?

The XC3S1000-5FGG320C positions itself as a practical mid-range Spartan®-3 FPGA option that combines a meaningful logic element count, embedded RAM, and a high I/O complement in a compact 320-BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a broad set of commercial electronic products where board space, I/O flexibility, and on-chip resources matter.

This device is well suited for designers and procurement teams targeting solutions that require programmable logic with defined power and environmental characteristics, offering predictable resource availability for system partitioning and long-term assembly compatibility.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the XC3S1000-5FGG320C.