XC3S1000-5FT256C

The XC3S1000-5FT256C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC designed for commercial-grade digital logic integration. It provides a balance of programmable logic, on-chip memory, and I/O resources in a compact 256-LBGA package.

With 17,280 logic elements, approximately 0.44 Mbits of embedded memory, 173 I/O pins and roughly 1,000,000 gates, this device is suited for commercial embedded designs that require moderate logic capacity, local memory, and significant interfacing capability. It operates from a 1.14 V to 1.26 V supply and supports an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 17,280 logic elements provide programmable resources for implementing custom digital functions and finite-state logic.
• Embedded Memory Approximately 0.44 Mbits of on-chip RAM to support buffering, temporary storage, and small data structures without external memory.
• I/O Capacity 173 general-purpose I/O pins enable interfacing to a wide range of peripherals and external logic.
• Gate Count An estimated 1,000,000 gates for overall device complexity and integration.
• Power and Operating Range Core supply voltage range of 1.14 V to 1.26 V with a commercial operating temperature range of 0 °C to 85 °C.
• Package and Mounting 256-LBGA package (supplier device package: 256-FTBGA, 17×17) designed for surface-mount assembly.
• Environmental Compliance RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Commercial Embedded Systems Implement custom control logic, protocol handling, and glue logic in commercial products that operate within 0 °C to 85 °C.
• I/O-Intensive Interfaces Use the 173 I/O pins to aggregate and translate signals between multiple peripherals and subsystems.
• On-Chip Data Buffering Leverage approximately 0.44 Mbits of embedded memory for local buffering and small data processing tasks without external RAM.
• Prototyping and Design Validation Deploy as a programmable platform for validating custom logic and verifying system-level integration in commercial environments.

Unique Advantages

• Ample Logic Capacity: 17,280 logic elements enable implementation of moderate-complexity digital designs on a single device.
• Integrated Memory: Approximately 0.44 Mbits of on-chip RAM reduces dependence on external memory for many buffering and control tasks.
• High I/O Count: 173 I/O pins provide flexibility for interfacing multiple peripherals and external components.
• Compact, Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) allows space-efficient board designs and high-density assembly.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C, suitable for a wide range of commercial applications.
• RoHS Compliant: Supports lead-free manufacturing and environmentally conscious production requirements.

Why Choose XC3S1000-5FT256C?

The XC3S1000-5FT256C delivers a practical combination of logic, memory, and I/O in a compact BGA package for commercial designs. Its 17,280 logic elements, substantial I/O count and on-chip RAM make it a strong fit for applications that require integrated digital logic and local data buffering without relying on external memory.

This device is well suited for engineers and teams designing commercial embedded systems, interface aggregation solutions, and design prototypes where a balance of capacity, package density, and RoHS compliance is required. The voltage and temperature specifications support standard commercial platforms and assembly processes.

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