XC3S1000L-4FGG456C

The XC3S1000L-4FGG456C is a Spartan®-3L Field Programmable Gate Array (FPGA) from AMD. It provides 17,280 logic elements and a high-density I/O interface in a compact ball-grid package, suitable for commercial embedded logic designs requiring on-chip memory and flexible I/O.

Key electrical and environmental characteristics include a core supply range of 1.14 V to 1.26 V, on-chip embedded memory totaling approximately 0.42 Mbits, 333 user I/Os, and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 17,280 logic elements and approximately 1,000,000 equivalent gates provide substantial programmable logic capacity for complex combinational and sequential designs.
• Configurable Logic Blocks 480 configurable logic blocks (CLBs) that implement the device's programmable logic fabric.
• On-Chip Memory Approximately 0.42 Mbits (442,368 bits) of embedded RAM for data buffering, FIFOs, and small memory structures.
• I/O Density 333 user I/Os delivering broad interfacing capability for parallel buses, peripherals, and mixed-signal front ends.
• Power Core voltage specified between 1.14 V and 1.26 V to match system power-rail designs and enable predictable core operation.
• Package & Mounting Surface-mount 456-BBGA package (supplier device package: 456-FBGA, 23×23) for high-density board implementations.
• Operating Conditions Commercial-grade temperature rating from 0 °C to 85 °C and RoHS-compliant construction.

Unique Advantages

• Substantial Logic Capacity: 17,280 logic elements support mid-range FPGA designs without external logic expansion.
• High I/O Count: 333 user I/Os simplify direct interfacing to sensors, memory, and peripheral devices, reducing the need for external I/O expanders.
• Embedded Memory On-Board: Approximately 0.42 Mbits of RAM enables local buffering and data-path implementation within the device.
• Compact Ball-Grid Packaging: 456-ball BGA package (456-FBGA, 23×23) allows dense PCB layouts while maintaining signal integrity.
• Predictable Power Envelope: Defined core supply range of 1.14 V to 1.26 V aids power-supply design and thermal planning.
• RoHS-Compliant: Environmentally compliant manufacturing minimizes regulatory hurdles for commercial deployments.

Why Choose XC3S1000L-4FGG456C?

The XC3S1000L-4FGG456C positions itself as a capable Spartan®-3L FPGA option for commercial designs that require a balance of logic capacity, on-chip memory, and a high number of user I/Os in a compact BGA footprint. Its defined core voltage range and commercial operating temperature make it suitable for standard embedded applications where predictable electrical characteristics and compact integration are priorities.

Designers seeking a mid-density FPGA with ample I/O and onboard RAM will find the XC3S1000L-4FGG456C useful for consolidating logic, reducing external component count, and maintaining a streamlined BOM in volume production environments.

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