XC3S100E-4CPG132C

The XC3S100E-4CPG132C is a Spartan®-3E field programmable gate array (FPGA) IC from AMD in a 132-TFBGA/CSPBGA package. It provides a balanced set of programmable logic, embedded memory, and I/O resources targeted for commercial electronic designs.

With a commercial operating temperature range and surface-mount BGA packaging, this device is suited for commercial applications that require moderate-density programmable logic and compact board-level integration.

Key Features

• FPGA Core  Spartan®-3E architecture in an FPGA IC package, offering reprogrammable logic resources for customizable digital designs.
• Logic Resources  2,160 logic elements to implement combinational and sequential logic functions at moderate density.
• On-chip Memory  73,728 total RAM bits—approximately 0.074 Mbits of embedded memory for data buffering and small lookup tables.
• I/O Count  83 user I/O pins to interface with external peripherals and system signals.
• Gate Equivalent  100,000 logical gates, providing scale for implementing control and data-path logic.
• Power  Voltage supply range of 1.14 V to 1.26 V to match system power-rail requirements.
• Package & Mounting  132-TFBGA / CSPBGA package (supplier package: 132-CSPBGA, 8×8) with surface-mount mounting for compact PCB designs.
• Commercial Grade & Temperature  Rated for commercial operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant, supporting lead-free manufacturing processes.
• Manufacturer  Produced by AMD, offering traceable supply and device identification.

Typical Applications

• Commercial Embedded Systems  Use the FPGA for programmable control logic and peripheral interfacing in commercial electronic products operating within 0 °C to 85 °C.
• Data-Path and Glue Logic  Implement custom data routing, protocol bridging, and glue logic between discrete components using the 2,160 logic elements and 83 I/Os.
• Memory Buffering & Small SRAM Functions  Leverage the device’s embedded RAM (73,728 bits) for small buffers, FIFOs, and LUT-based storage in system designs.

Unique Advantages

• Balanced logic and I/O density: 2,160 logic elements paired with 83 I/Os provide a practical balance for mid-range designs that need both logic capacity and connectivity.
• Compact BGA packaging: The 132-TFBGA/CSPBGA (132-CSPBGA, 8×8) surface-mount package minimizes PCB area while retaining necessary I/O and routing.
• Defined power envelope: Operates within a narrow supply range (1.14 V–1.26 V) to simplify power-rail planning and ensure predictable device behavior.
• On-chip embedded memory: Approximately 0.074 Mbits of RAM for local buffering and small data-storage needs without external memory.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation to match standard commercial product environments.
• RoHS compliant: Supports lead-free assembly and environmental regulatory requirements for commercial electronics.

Why Choose XC3S100E-4CPG132C?

The XC3S100E-4CPG132C delivers a practical combination of programmable logic capacity, embedded memory, and I/O in a compact BGA form factor well suited to commercial electronic designs. Its defined supply range and commercial temperature rating make it straightforward to integrate into systems with standard power and thermal envelopes.

This part is a fit for designers seeking a mid-density Spartan®-3E FPGA from AMD for applications that require flexible logic implementation, modest on-chip RAM, and a compact surface-mount package with RoHS compliance.

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