XC3S100E-4TQ144I

The XC3S100E-4TQ144I is an industrial‑grade Spartan®-3E field programmable gate array (FPGA) from AMD supplied in a 144‑LQFP package. It provides 2,160 logic elements, 73,728 bits of on‑chip RAM and 108 user I/O pins, making it suitable for embedded and industrial designs that require programmable logic, on‑chip memory and a moderate I/O complement.

Key Features

• FPGA Core Spartan®-3E architecture in an industrial-grade device; 2,160 logic elements for implementing custom digital logic.
• On‑Chip Memory 73,728 bits of embedded RAM to support data buffering, small lookup tables and state storage.
• I/O Capacity 108 user I/O pins for flexible interfacing with peripherals, sensors and external logic.
• Logic Density Approximately 100,000 gates of logic capacity for mid-range digital designs.
• Power Supply Core voltage supply range of 1.14 V to 1.26 V for the device core.
• Package & Mounting 144‑LQFP package (supplier device package: 144‑TQFP, 20×20) with surface‑mount mounting for PCB integration.
• Operating Range Industrial temperature range: –40°C to 100°C for deployment in demanding environments.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control Implement custom control logic and I/O aggregation using the device’s logic elements and 108 I/Os in industrial automation systems.
• Embedded Systems & Prototyping Use as a programmable logic platform for embedded prototypes and small‑volume production designs requiring on‑chip RAM and gate capacity.
• Communications and Interface Bridging Implement protocol glue logic, custom interfaces or small packet processing functions leveraging the available logic and memory resources.

Unique Advantages

• Industrial Temperature Support: Rated from –40°C to 100°C to meet environmental demands of industrial deployments.
• Balanced Logic and Memory: 2,160 logic elements combined with 73,728 bits of on‑chip RAM enable compact, integrated logic and buffering functions.
• Generous I/O Count: 108 I/O pins provide flexibility for connecting multiple peripherals and external signals without external glue logic.
• Compact Surface‑Mount Packaging: 144‑LQFP (144‑TQFP, 20×20) supports dense PCB layouts and automated assembly.
• Low Core Voltage Operation: Core supply range of 1.14 V to 1.26 V for compatibility with low‑voltage system designs.
• RoHS Compliant: Meets lead‑free and environmental requirements for modern manufacturing.

Why Choose XC3S100E-4TQ144I?

The XC3S100E-4TQ144I positions itself as a practical, industrial‑grade FPGA option for designers who need a mid‑range logic device with on‑chip RAM and a substantial I/O count in a compact LQFP package. Its combination of 2,160 logic elements, 73,728 bits of embedded memory and 108 I/Os makes it well suited to embedded control, interface bridging and prototyping applications where reliability and board‑level integration are important.

Manufactured by AMD and supplied in a 144‑pin surface‑mount package, the XC3S100E-4TQ144I delivers a verifiable set of specifications that support scalable designs and straightforward integration into industrial and embedded systems.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S100E-4TQ144I and to discuss how it can fit into your next design.