XC3S100E-4VQ100I

The XC3S100E-4VQ100I is a Spartan®-3E field programmable gate array (FPGA) in a 100‑TQFP package designed for programmable-logic implementation. It integrates 2,160 logic elements, 66 I/Os and on-chip RAM to support embedded logic and I/O-centric designs requiring a compact, surface-mount solution.

With an operating voltage range of 1.14 V to 1.26 V and an industrial operating temperature range of -40 °C to 100 °C, this device is suited for applications that need programmable logic combined with extended temperature tolerance and RoHS compliance.

Key Features

• Core Logic 2,160 logic elements provide programmable resources for custom digital functions and control logic.
• Embedded Memory Approximately 0.074 Mbits (73,728 bits) of on-chip RAM to support data buffering, small FIFOs and control-state storage.
• I/O Capacity 66 general-purpose I/Os for interfacing to peripherals, sensors and external logic devices.
• Gate Count 100,000 gates enabling implementation of moderate-complexity digital designs.
• Power Supply voltage range of 1.14 V to 1.26 V for core operation.
• Package and Mounting 100‑TQFP package (supplier device package: 100‑VQFP (14x14)) in a surface-mount form factor for compact PCB layouts.
• Temperature and Grade Industrial grade with an operating temperature range of -40 °C to 100 °C for use in temperature-challenging environments.
• Regulatory RoHS compliant to support environmentally conscious designs and manufacturing.

Typical Applications

• Industrial Control — Implements control logic, sequencing and interface bridging for factory automation and machine controllers while operating across an industrial temperature range.
• Embedded Systems — Provides programmable logic and on-chip RAM for custom processing blocks, peripheral glue logic and small data buffering in embedded products.
• I/O Expansion and Bridging — Uses available I/O pins to aggregate or translate signals between subsystems and external devices.
• Prototyping and Development — Compact surface-mount package and moderate logic density make the device suitable for board-level prototypes and proof-of-concept designs.

Unique Advantages

• Balanced Logic and I/O Count: 2,160 logic elements combined with 66 I/Os deliver a versatile mix of programmable logic and connectivity for a wide range of mid-density applications.
• On-Chip Memory: Approximately 0.074 Mbits of embedded RAM supports local buffering and small data structures without external memory.
• Compact, Surface-Mount Package: 100‑TQFP (100‑VQFP, 14x14) enables space-efficient PCB designs while retaining a high pin count.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for reliable operation in harsher thermal environments.
• RoHS Compliant: Conforms to environmental requirements to simplify regulatory compliance during manufacturing.
• Defined Power Envelope: Core supply range of 1.14 V to 1.26 V supports predictable power budgeting in system design.

Why Choose XC3S100E-4VQ100I?

The XC3S100E-4VQ100I positions itself as a mid-density, industrial-grade FPGA that combines programmable logic, on-chip memory and a substantial I/O count in a compact 100‑TQFP surface-mount package. Its specified operating voltage and wide temperature range make it a pragmatic choice for designers who need reliable, field-programmable capability without the footprint of larger devices.

This device is well suited for engineers building embedded control, I/O interfacing and prototyping solutions that require a balance of logic resources, memory and environmental tolerance. The combination of measurable specifications—logic elements, RAM bits, I/O count, gate capacity and RoHS compliance—supports predictable integration into longer-term designs.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S100E-4VQ100I and to discuss how it can fit into your next design.