XC3S100E-4VQG100C
| Part Description |
Spartan®-3E Field Programmable Gate Array (FPGA) IC 66 73728 2160 100-TQFP |
|---|---|
| Quantity | 144 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 66 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 240 | Number of Logic Elements/Cells | 2160 | ||
| Number of Gates | 100000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of XC3S100E-4VQG100C – Spartan®-3E Field Programmable Gate Array (FPGA) IC 66 73728 2160 100-TQFP
The XC3S100E-4VQG100C is a Spartan®-3E series FPGA IC from AMD designed for programmable logic applications. It integrates configurable logic, on-chip RAM, and a moderate I/O count in a 100-pin TQFP package, targeted at commercial-grade embedded and digital designs that require compact, reprogrammable logic resources.
Key on-chip resources include 240 CLBs (providing 2,160 logic elements), approximately 73,728 bits of embedded RAM, and support for up to 66 I/O pins. The device operates from a supply voltage range of 1.14 V to 1.26 V and is rated for commercial temperature operation from 0°C to 85°C.
Key Features
- Core Logic 240 configurable logic blocks (CLBs) delivering 2,160 logic elements for implementing custom digital logic and state machines.
- On-Chip Memory Approximately 73,728 bits of embedded RAM to support buffering, small lookup tables, and local data storage.
- I/O Capacity 66 general-purpose I/O pins suitable for interfacing with sensors, peripherals, and external logic.
- Gate Density 100,000 logic gates providing a compact logic fabric for moderate-complexity applications.
- Power and Temperature Operates from 1.14 V to 1.26 V and rated for commercial temperature range from 0°C to 85°C.
- Package and Mounting 100-TQFP (100-VQFP, 14×14 mm) surface-mount package for compact PCB implementations and established assembly processes.
- Environmental RoHS compliant.
Typical Applications
- Embedded Logic Integration Implement glue logic, protocol translators, or custom control functions where reprogrammability and moderate logic density are required.
- Digital Prototyping Use the device for hardware validation and iterative design development that benefits from on-chip reconfiguration and local RAM.
- Peripheral and Interface Control Manage multiple peripheral interfaces or coordinate I/O-intensive tasks using the device's 66 available I/O pins.
Unique Advantages
- Balanced Logic and Memory Resources: 240 CLBs with 2,160 logic elements alongside 73,728 bits of RAM provide a practical mix of logic and storage for mid-range designs.
- Compact, PCB-Friendly Package: 100-TQFP surface-mount package enables space-efficient board layouts while supporting standard assembly methods.
- Defined Commercial Temperature Range: Rated for 0°C to 85°C operation, making it suitable for a wide range of commercial applications.
- Managed Power Envelope: Narrow supply range (1.14 V to 1.26 V) supports predictable power planning in system designs.
- Compliance: RoHS compliant, supporting environmental and regulatory requirements for many commercial products.
Why Choose XC3S100E-4VQG100C?
The XC3S100E-4VQG100C positions itself as a compact, reprogrammable logic device that combines a moderate gate count, a defined on-chip memory budget, and a practical I/O complement in a 100-pin TQFP package. It is well suited to designers who need flexible logic implementation with the ability to iterate hardware functionality without changing silicon.
This device offers an attractive balance of integration and predictability for commercial embedded systems, digital prototyping, and peripheral control tasks. Its RoHS compliance and standard package form factor support long-term manufacturability and supply-chain integration within commercial product lines.
Request a quote or submit an inquiry to check availability and pricing for the XC3S100E-4VQG100C and to discuss your volume or delivery needs.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








