XC3S100E-4VQG100I

The XC3S100E-4VQG100I is a Spartan®-3E field programmable gate array (FPGA) in a 100-TQFP surface-mount package. It delivers a moderate logic capacity and on-chip memory with industrial temperature capability for embedded and industrial applications.

With 240 configurable logic blocks (CLBs), 2,160 logic elements, 66 general-purpose I/O pins and approximately 0.0737 Mbits of embedded RAM, this device is suited to designs that require flexible logic, I/O integration and reliable operation across a wide temperature range.

Key Features

• FPGA Core 240 CLBs and 2,160 logic elements provide a reconfigurable fabric for implementing custom digital logic and control functions.
• Embedded Memory Approximately 0.0737 Mbits of on-chip RAM for small FIFOs, state storage and buffering within the fabric.
• I/O Count 66 general-purpose I/O pins to interface with peripherals, sensors and external logic devices.
• Gate Equivalent Roughly 100,000 gates of logic capacity for moderate-complexity designs.
• Power Core supply operating range from 1.14 V to 1.26 V to match platform power rails.
• Package and Mounting 100-pin TQFP (supplier package 100-VQFP, 14×14) surface-mount package for compact board-level integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance RoHS compliant for regulatory and environmental compatibility.

Typical Applications

• Industrial Control and Automation Implement control logic, I/O aggregation and protocol bridging for industrial systems requiring extended temperature operation.
• Embedded System Glue Logic Provide custom glue logic, bus interfacing and peripheral control in compact embedded designs.
• Signal Aggregation and Preprocessing Use the FPGA fabric and on-chip RAM for small-scale data buffering and preprocessing ahead of downstream processors.

Unique Advantages

• Industrial-grade temperature rating Operation from −40 °C to 100 °C supports deployment in demanding environmental conditions.
• Balanced logic and I/O 2,160 logic elements combined with 66 I/O pins enable mid-density designs that require both logic capacity and external connectivity.
• Compact surface-mount package 100-TQFP (14×14 VQFP) package simplifies PCB layout for space-constrained boards.
• Low-voltage core operation Core supply range of 1.14 V to 1.26 V for compatibility with modern low-voltage power domains.
• RoHS compliant Meets RoHS requirements to support environmental and regulatory goals.
• Manufacturer backing Produced by AMD, providing a recognized supplier for procurement and lifecycle considerations.

Why Choose XC3S100E-4VQG100I?

The XC3S100E-4VQG100I positions itself as a practical FPGA choice for mid-density embedded and industrial designs that need reliable operation across a wide temperature range and a balance of logic, memory and I/O. Its combination of 240 CLBs, 2,160 logic elements and 66 I/Os makes it well suited to control, interface and preprocessing tasks where a compact, surface-mount solution is required.

Designed for engineers and procurement teams seeking a reconfigurable device from a recognized manufacturer, this Spartan®-3E part offers predictable integration into systems that value industrial temperature capability, RoHS compliance and a compact 100-pin package.

If you need pricing, availability or a formal quote for the XC3S100E-4VQG100I, request a quote or submit an inquiry to receive detailed ordering information and lead-time options.