XC3S100E-4TQG144I
| Part Description |
Spartan®-3E Field Programmable Gate Array (FPGA) IC 108 73728 2160 144-LQFP |
|---|---|
| Quantity | 526 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 108 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 240 | Number of Logic Elements/Cells | 2160 | ||
| Number of Gates | 100000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of XC3S100E-4TQG144I – Spartan®-3E Field Programmable Gate Array (FPGA) IC, 2160 Logic Elements, 144-LQFP
The XC3S100E-4TQG144I is a Spartan®-3E family FPGA in a 144-LQFP surface-mount package, offering a compact, industrial-grade programmable logic device. With 2160 logic elements, 240 CLBs and 73,728 bits of on-chip RAM, it targets designs that require moderate logic density, embedded memory, and a robust operating range.
This device is specified for industrial use with an operating temperature range of −40 °C to 100 °C and a core voltage supply range of 1.14 V to 1.26 V, making it suitable where temperature resilience and defined power rails are required.
Key Features
- Core Logic Approximately 2160 logic elements implemented across 240 CLBs, providing modular programmable logic for custom digital functions.
- Embedded Memory Approximately 0.074 Mbits of on-chip RAM (73,728 bits) for data buffering, small FIFOs, and state storage.
- I/O and Gate Count 108 user I/O pins and an estimated 100,000 gate-equivalents to support interface and glue-logic requirements.
- Power Core voltage range from 1.14 V to 1.26 V, enabling defined power-supply design and predictable power behavior.
- Package and Mounting 144-LQFP (supplier device package: 144-TQFP 20×20) in a surface-mount form factor for compact board layouts.
- Industrial Grade Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature capability.
- RoHS Compliant Manufactured in compliance with RoHS environmental requirements.
Typical Applications
- Industrial Control Systems Use the device for control logic, custom state machines, and interface handling where industrial temperature operation is required.
- Prototyping and Development Provides moderate logic density (2160 logic elements) and embedded RAM suitable for evaluating and developing custom digital designs.
- Interface and Glue Logic With 108 I/O pins and ~100k gates, implement protocol bridging, bus interfacing, and custom peripheral logic.
Unique Advantages
- Balanced Logic and Memory Combines 2160 logic elements with 73,728 bits of embedded RAM to handle a range of mid-scale logic and buffering needs without external memory for smaller data requirements.
- Industrial Temperature Range Specified for −40 °C to 100 °C operation to support deployment in harsher environments and broaden application scope.
- Defined Power Envelope Narrow core supply range (1.14 V–1.26 V) simplifies power sequencing and voltage regulation design decisions.
- Compact Surface-Mount Package 144-LQFP package enables a small PCB footprint while providing a substantial number of I/O for system integration.
- RoHS Compliant Designed to meet environmental compliance requirements for modern electronics manufacturing.
Why Choose XC3S100E-4TQG144I?
The XC3S100E-4TQG144I positions itself as a practical choice for engineers seeking a mid-density Spartan®-3E FPGA with on-chip memory and a robust industrial temperature rating. Its combination of 2160 logic elements, 108 I/O, and approximately 73,728 bits of embedded RAM delivers the integration needed for custom control, interface, and prototyping tasks while maintaining a compact 144-LQFP surface-mount footprint.
This device is appropriate for designs that require predictable power rails and extended temperature operation, offering a concise set of capabilities for industrial and embedded applications where moderate logic capacity and local memory are key considerations.
Request a quote or submit a procurement inquiry to receive pricing and availability for the XC3S100E-4TQG144I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








