XC3S100E-4TQG144I

IC FPGA 108 I/O 144TQFP
Part Description

Spartan®-3E Field Programmable Gate Array (FPGA) IC 108 73728 2160 144-LQFP

Quantity 526 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O108Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs240Number of Logic Elements/Cells2160
Number of Gates100000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of XC3S100E-4TQG144I – Spartan®-3E Field Programmable Gate Array (FPGA) IC, 2160 Logic Elements, 144-LQFP

The XC3S100E-4TQG144I is a Spartan®-3E family FPGA in a 144-LQFP surface-mount package, offering a compact, industrial-grade programmable logic device. With 2160 logic elements, 240 CLBs and 73,728 bits of on-chip RAM, it targets designs that require moderate logic density, embedded memory, and a robust operating range.

This device is specified for industrial use with an operating temperature range of −40 °C to 100 °C and a core voltage supply range of 1.14 V to 1.26 V, making it suitable where temperature resilience and defined power rails are required.

Key Features

  • Core Logic  Approximately 2160 logic elements implemented across 240 CLBs, providing modular programmable logic for custom digital functions.
  • Embedded Memory  Approximately 0.074 Mbits of on-chip RAM (73,728 bits) for data buffering, small FIFOs, and state storage.
  • I/O and Gate Count  108 user I/O pins and an estimated 100,000 gate-equivalents to support interface and glue-logic requirements.
  • Power  Core voltage range from 1.14 V to 1.26 V, enabling defined power-supply design and predictable power behavior.
  • Package and Mounting  144-LQFP (supplier device package: 144-TQFP 20×20) in a surface-mount form factor for compact board layouts.
  • Industrial Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature capability.
  • RoHS Compliant  Manufactured in compliance with RoHS environmental requirements.

Typical Applications

  • Industrial Control Systems  Use the device for control logic, custom state machines, and interface handling where industrial temperature operation is required.
  • Prototyping and Development  Provides moderate logic density (2160 logic elements) and embedded RAM suitable for evaluating and developing custom digital designs.
  • Interface and Glue Logic  With 108 I/O pins and ~100k gates, implement protocol bridging, bus interfacing, and custom peripheral logic.

Unique Advantages

  • Balanced Logic and Memory  Combines 2160 logic elements with 73,728 bits of embedded RAM to handle a range of mid-scale logic and buffering needs without external memory for smaller data requirements.
  • Industrial Temperature Range  Specified for −40 °C to 100 °C operation to support deployment in harsher environments and broaden application scope.
  • Defined Power Envelope  Narrow core supply range (1.14 V–1.26 V) simplifies power sequencing and voltage regulation design decisions.
  • Compact Surface-Mount Package  144-LQFP package enables a small PCB footprint while providing a substantial number of I/O for system integration.
  • RoHS Compliant  Designed to meet environmental compliance requirements for modern electronics manufacturing.

Why Choose XC3S100E-4TQG144I?

The XC3S100E-4TQG144I positions itself as a practical choice for engineers seeking a mid-density Spartan®-3E FPGA with on-chip memory and a robust industrial temperature rating. Its combination of 2160 logic elements, 108 I/O, and approximately 73,728 bits of embedded RAM delivers the integration needed for custom control, interface, and prototyping tasks while maintaining a compact 144-LQFP surface-mount footprint.

This device is appropriate for designs that require predictable power rails and extended temperature operation, offering a concise set of capabilities for industrial and embedded applications where moderate logic capacity and local memory are key considerations.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC3S100E-4TQG144I.

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