XC3S100E-4TQG144C
| Part Description |
Spartan®-3E Field Programmable Gate Array (FPGA) IC 108 73728 2160 144-LQFP |
|---|---|
| Quantity | 832 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 108 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 240 | Number of Logic Elements/Cells | 2160 | ||
| Number of Gates | 100000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of XC3S100E-4TQG144C – Spartan®-3E FPGA, 2160 logic elements, 144-LQFP
The XC3S100E-4TQG144C is a Spartan®-3E field programmable gate array (FPGA) from AMD, offering a compact, surface-mount FPGA solution in a 144-pin LQFP package. With 240 CLBs and 2,160 logic elements, it is designed for applications that require customizable digital logic, moderate on-chip memory, and a substantial number of user I/O connections.
This commercial-grade device targets embedded and programmable-logic designs that benefit from on-chip RAM, flexible I/O, and low-voltage core operation, enabling integration of custom logic and data buffering in space-constrained boards.
Key Features
- Logic Capacity 240 CLBs and 2,160 logic elements provide a balanced resource set for implementing custom digital functions and control logic.
- Embedded Memory 73,728 bits of on-chip RAM (approximately 0.0737 Mbits) for data buffering, FIFOs, and small lookup tables.
- I/O Resources 108 user I/O pins support a variety of external interfaces and parallel connectivity on a single device.
- Gate Equivalent Approximately 100,000 gates for sizing and partitioning hybrid logic and glue functions within system designs.
- Power Core voltage range from 1.14 V to 1.26 V to match low-voltage FPGA power domains.
- Package & Mounting 144-LQFP surface-mount package (supplier device package listed as 144-TQFP, 20×20) for compact PCB layouts and automated assembly.
- Operating Conditions Commercial-grade operation over 0 °C to 85 °C for typical commercial environment deployments.
- RoHS Compliant Environmentally compliant lead-free device.
Typical Applications
- Custom Digital Logic: Implement state machines, glue logic, and protocol translators using the device's CLBs and logic elements.
- Embedded System Control: Use the FPGA's logic and I/O resources for control functions, sensor interfacing, and peripheral management in commercial products.
- Prototyping and Development: Rapidly iterate hardware designs and validate algorithms on a compact, surface-mount FPGA platform.
- Data Buffering and Small Memory Tasks: Leverage the on-chip RAM for buffering, small FIFOs, and lookup tables in timing-sensitive data paths.
Unique Advantages
- Balanced Logic and Memory: Combines 240 CLBs and approximately 0.0737 Mbits of embedded RAM for mixed logic and buffering tasks without external memory.
- High I/O Count in a Compact Package: 108 I/O pins in a 144-LQFP surface-mount package enable rich external connectivity while conserving PCB area.
- Low-Voltage Core: Narrow core voltage range (1.14 V–1.26 V) suitable for designs that use modern low-voltage power rails.
- Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation for a wide range of commercial applications and environments.
- RoHS Compliant: Lead-free manufacturing compatibility simplifies regulatory and environmental compliance for product designs.
Why Choose XC3S100E-4TQG144C?
The XC3S100E-4TQG144C positions itself as a compact, commercial-grade FPGA that balances logic capacity, embedded RAM, and a substantial I/O complement in a surface-mount 144-pin package. Its specifications make it well suited for designers who need selectable hardware logic, moderate on-chip memory, and flexible interfacing in space-constrained boards.
For teams developing commercial embedded systems, prototypes, or control logic implementations, this Spartan®-3E device provides a practical combination of integration, predictable operating conditions, and RoHS compliance, enabling straightforward placement into production workflows.
Request a quote or submit an inquiry to obtain pricing and availability for the XC3S100E-4TQG144C and accelerate your design planning.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








