XC3S100E-4CPG132I

The XC3S100E-4CPG132I is a Spartan®-3E Field Programmable Gate Array (FPGA) integrated circuit from AMD supplied in a 132-TFBGA / 132-CSPBGA (8×8) package. It provides mid-range programmable logic resources with on-chip RAM, a defined I/O count, and industrial-grade temperature and supply specifications for deployment in temperature-sensitive environments.

Key Features

• Core Logic  Approximately 2,160 logic elements supporting custom digital logic and control functions.
• Logic Array Blocks  240 logic array blocks (LABs) for structured resource allocation.
• Embedded Memory  Approximately 0.074 Mbits of on-chip RAM (73,728 total RAM bits) for buffering, small FIFOs, and state storage.
• I/O  83 available I/O pins to connect peripherals, sensors, and external logic directly to the programmable fabric.
• Gate Count  Approximately 100,000 gates for implementing combinational and sequential logic.
• Power  Core supply range of 1.14 V to 1.26 V to match target system power rails.
• Package  132-TFBGA / 132-CSPBGA (8×8) surface-mount package for compact board-level integration.
• Temperature Rating  Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• Industrial Control  Industrial systems that require an industrial-grade FPGA for control logic and I/O consolidation within a constrained PCB footprint.
• I/O Expansion & Interface Bridging  Designs needing up to 83 I/O signals for protocol bridging, signal aggregation, or peripheral interfacing.
• Custom Logic & State Machines  Implementing bespoke finite-state machines, glue logic, and timing control using the available logic elements and embedded RAM.

Unique Advantages

• Balanced Logic and Memory Capacity: Combines approximately 2,160 logic elements with 73,728 bits of RAM to support both combinational logic and local data storage without external memory for small-to-mid complexity designs.
• Industrial Temperature Support: Rated for −40 °C to 100 °C operation, enabling reliable performance in temperature-challenging installations.
• Compact BGA Package: 132-TFBGA / 132-CSPBGA (8×8) surface-mount package reduces board area while providing sufficient I/O for mid-range systems.
• Low-Voltage Core: Core supply of 1.14–1.26 V supports modern low-voltage power domains and efficient power delivery.
• Regulatory Compatibility: RoHS compliance simplifies lead-free assembly and supports broader manufacturing requirements.
• Proven Manufacturer: Produced by AMD, aligning the device with an established FPGA supplier.

Why Choose XC3S100E-4CPG132I?

The XC3S100E-4CPG132I positions itself as a mid-range Spartan®-3E FPGA optimized for industrial deployments where a balance of logic capacity, embedded memory, and I/O is required. Its industrial temperature rating, compact 132-CSPBGA package, and defined supply range make it suitable for engineers specifying reliable, board-level programmable logic in space-constrained designs.

This part is appropriate for teams implementing custom control logic, interface bridging, or modest data buffering without the need for large external memory, and for procurement seeking RoHS-compliant, industrial-grade FPGA components from an established manufacturer.

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