XC3S1000L-4FTG256C

The XC3S1000L-4FTG256C is a Spartan®-3L field programmable gate array (FPGA) from AMD, offered in a 256-LBGA package. It provides a mid-density, reprogrammable logic platform with 17,280 logic elements and approximately 0.44 Mbits of embedded RAM for commercial embedded and digital designs.

Designed for configurable digital logic implementations, the device includes a broad I/O count and a compact surface-mount BGA package while operating within a 1.14 V to 1.26 V core supply range and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  17,280 logic elements enabling mid-density programmable logic and custom digital implementations.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 total RAM bits) to support data buffering and state storage.
• I/O Connectivity  173 user I/O pins to support a wide range of interface and peripheral connections.
• Gate Equivalent  Approximately 1,000,000 gates for comprehensive logic mapping and integration.
• Power  Core voltage supply range of 1.14 V to 1.26 V for the FPGA core.
• Package & Mounting  256-LBGA package (supplier package: 256-FTBGA 17×17) with surface-mount mounting for compact board designs.
• Operating Range  Commercial-grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS compliant, meeting common environmental requirements for lead-free assembly.

Typical Applications

• Custom Digital Logic  Implement application-specific control and sequencing logic using the device’s 17,280 logic elements.
• I/O Interface and Bridging  Use the 173 I/O pins to connect and translate between multiple peripherals and interfaces on a single device.
• Embedded Memory-Dependent Functions  Leverage approximately 0.44 Mbits of on-chip RAM for buffering, small lookup tables, and state machines.

Unique Advantages

• High Logic Density:  17,280 logic elements provide substantial capacity for mid-scale logic designs without external logic devices.
• Integrated On-Chip RAM:  Approximately 0.44 Mbits of embedded memory reduces reliance on external memory for many control and buffering tasks.
• Generous I/O Count:  173 I/O pins support multiple peripherals and interface standards on a single package.
• Compact BGA Package:  256-LBGA (256-FTBGA, 17×17) enables space-efficient board layouts and surface-mount assembly.
• Commercial Temperature and RoHS Compliance:  Rated for 0 °C to 85 °C and RoHS compliant for mainstream commercial deployments and lead-free manufacturing.
• Low-Voltage Core:  Operates from 1.14 V to 1.26 V, aligning with modern low-voltage system architectures.

Why Choose XC3S1000L-4FTG256C?

The XC3S1000L-4FTG256C positions itself as a commercially graded, mid-density FPGA solution from AMD suitable for designers who need a balance of logic capacity, embedded memory, and extensive I/O in a compact BGA package. Its 17,280 logic elements and roughly 0.44 Mbits of on-chip RAM make it well suited to consolidate functions that would otherwise require multiple discrete components.

For development teams and procurement professionals targeting commercial embedded systems, the device offers an integrated, RoHS-compliant option with a defined operating voltage range and temperature rating, enabling predictable integration into board-level designs.

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