XC3S1000-5FTG256C

The XC3S1000-5FTG256C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD in a 256‑LBGA surface-mount package. It delivers a balanced combination of programmable logic capacity, on-chip memory, and I/O resources for commercial electronic designs.

Key on-chip resources include 17,280 logic elements, approximately 0.42 Mbits of embedded memory (442,368 total RAM bits), 173 user I/Os, and a nominal core supply range of 1.14 V to 1.26 V, all rated for commercial operation from 0 °C to 85 °C.

Key Features

• Core Logic 17,280 logic elements (cells) providing substantial gate count for custom digital functions (1,000,000 gates).
• Embedded Memory Approximately 0.42 Mbits of on-chip RAM (442,368 total RAM bits) for buffering, state storage, and small lookup tables.
• I/O Resources 173 user I/Os to support a wide range of external interfaces and peripheral connections.
• Power Core voltage supply range of 1.14 V to 1.26 V to match targeted low-voltage system designs.
• Package & Mounting 256‑LBGA package (supplier package: 256‑FTBGA, 17×17) in a surface-mount form factor for compact PCB integration.
• Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Compliance RoHS compliant.

Unique Advantages

• Substantial logic capacity: 17,280 logic elements and an approximate 1,000,000-gate equivalent enable implementation of complex custom logic without external ASICs.
• On-chip memory: Approximately 0.42 Mbits of embedded RAM reduces reliance on external memory for buffering and small-data storage.
• Generous I/O count: 173 user I/Os simplify board-level integration with sensors, controllers, and peripherals.
• Compact, surface-mount package: 256‑LBGA (17×17) allows high-density placement on modern PCBs while maintaining signal routing flexibility.
• Low-voltage core operation: 1.14 V to 1.26 V supply range supports designs targeting reduced core power domains.
• Commercial readiness: Commercial temperature rating and RoHS compliance support standard commercial product deployments.

Why Choose XC3S1000-5FTG256C?

The XC3S1000-5FTG256C positions itself as a commercial-grade, mid-capacity FPGA that combines meaningful logic density, integrated memory, and a high I/O count in a compact 256‑LBGA package. Its specifications make it suitable for designs that require significant programmable logic and on-chip resources while maintaining a small PCB footprint and low-voltage core operation.

For designers and procurement teams evaluating FPGA options for commercial applications, this device provides a verifiable set of resources—logic elements, embedded RAM, I/O count, and package attributes—that can be matched directly to system requirements and constraints.

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