XC3S1000-5FGG456C

The XC3S1000-5FGG456C is a Spartan®-3 field programmable gate array (FPGA) IC from AMD. It provides 17,280 logic elements and approximately 0.44 Mbits of embedded memory, packaged in a 456-ball BGA (23 × 23) surface-mount package.

Key electrical and environmental parameters provided for design integration include a core supply range of 1.14 V to 1.26 V, support for 333 I/O, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic  17,280 logic elements supporting complex digital designs and logic implementation.
• On-Chip Memory  Approximately 0.44 Mbits of embedded RAM (442,368 bits) for local storage and buffering.
• Gate Count  Approximately 1,000,000 gates for substantial functional density.
• I/O Capacity  333 available I/O pins to support multiple external interfaces and signals.
• Package  456-ball BGA (23 × 23) surface-mount package for compact board-level integration.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power budgeting and regulator selection.
• Temperature Grade  Commercial operating range: 0 °C to 85 °C, suitable for standard commercial applications.
• Compliance  RoHS compliant, meeting common environmental requirements for electronics manufacturing.

Typical Applications

• Custom digital logic  Designs that require up to 17,280 logic elements and approximately 0.44 Mbits of embedded memory for application-specific processing.
• I/O-dense implementations  Systems that need support for up to 333 I/O signals in a compact BGA footprint.
• Embedded system integration  Boards where a surface-mount FPGA with a 456-BBGA package and defined core voltage (1.14–1.26 V) fits the power and layout constraints.

Unique Advantages

• High functional density: 17,280 logic elements and ~1,000,000 gates enable substantial logic implementation within a single device.
• On-chip memory availability: Approximately 0.44 Mbits of embedded RAM reduces dependency on external memory for local buffering and state storage.
• Rich I/O support: 333 I/O pins provide flexibility for connecting multiple peripherals and interfaces without external I/O expanders.
• Compact BGA package: 456-ball (23 × 23) BGA package supports high-pin-count integration while minimizing PCB footprint.
• Defined power envelope: Narrow core voltage range (1.14–1.26 V) simplifies power-supply design and voltage sequencing considerations.
• RoHS compliant: Conforms to common environmental manufacturing requirements.

Why Choose XC3S1000-5FGG456C?

The XC3S1000-5FGG456C offers a balanced combination of logic capacity, embedded memory, and I/O resources in a compact 456-BBGA surface-mount package. Its defined core voltage range and commercial temperature rating make it suitable for standard electronic products that require significant programmable logic and on-chip RAM.

Manufactured by AMD and RoHS compliant, this Spartan®-3 FPGA is positioned for designs that need a measurable level of integration and predictable electrical characteristics while maintaining a small board footprint.

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