XC3S1000-5FG456C

The XC3S1000-5FG456C is an AMD Spartan®-3 Field Programmable Gate Array (FPGA) provided in a 456-ball BGA package. It delivers a balance of programmable logic capacity, on-chip memory, and I/O count suitable for commercial designs requiring configurable digital logic.

Key device attributes include 17,280 logic elements, approximately 0.44 Mbits of embedded RAM, 333 I/O, a 1.14 V–1.26 V supply range, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  17,280 logic elements provide the core programmable resources for implementing custom digital functions.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for buffering, state storage, and small memory structures.
• I/O Resources  333 general-purpose I/O pins to support a variety of external interfaces and board-level connections.
• Gate Equivalent  Rated at 1,000,000 gates for workload-sizing and partitioning considerations.
• Power  Operates from a 1.14 V to 1.26 V supply range, matching modern low-voltage power domains.
• Package & Mounting  456-ball BGA (456-FBGA, 23 × 23) in a surface-mount format for compact board integration.
• Temperature & Grade  Commercial grade device with an operating range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Commercial embedded systems  Implement custom digital logic and interface functions using the device’s 17,280 logic elements and 333 I/O pins.
• Interface bridging and protocol conversion  Use on-chip resources and embedded RAM to buffer and translate between different signal domains.
• Prototyping and development platforms  Leverage the programmable fabric and gate capacity to validate and iterate digital designs during development cycles.

Unique Advantages

• Substantial logic density: 17,280 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
• On-chip buffering: Approximately 0.44 Mbits of embedded RAM supports local data storage and low-latency buffering without external memory.
• High I/O count: 333 I/O pins simplify external interfacing and reduce the need for additional I/O expanders.
• Compact BGA package: 456-ball FBGA (23 × 23) surface-mount package enables dense PCB layouts and efficient use of board area.
• Low-voltage operation: 1.14 V–1.26 V supply compatibility supports integration with modern low-voltage power rails.
• Regulatory readiness: RoHS compliance aligns with common environmental requirements for commercial products.

Why Choose XC3S1000-5FG456C?

The XC3S1000-5FG456C combines a meaningful balance of logic resources, on-chip memory, and I/O capacity in a compact surface-mount BGA package. Its commercial-grade operating range and RoHS compliance make it a practical choice for engineers implementing configurable digital logic within 0 °C to 85 °C environments.

This AMD-manufactured Spartan®-3 FPGA is suited to designers who need programmable logic density, embedded RAM, and a high I/O count in a single device footprint, enabling reduced part count and simplified board designs.

Request a quote or submit a purchase inquiry to get pricing and availability for the XC3S1000-5FG456C.