XC3S1000-5FGG676C

The XC3S1000-5FGG676C is an AMD Spartan®-3 field programmable gate array (FPGA) supplied in a 676-ball BGA package. It delivers reconfigurable logic capacity and on-chip memory suitable for designs that require moderate logic density and flexible I/O integration.

Key hardware characteristics include 17,280 logic elements, approximately 0.44 Mbits of embedded RAM, 391 I/O pins and a 1,000,000-gate equivalent, all provided in a 676-FBGA (27×27) surface-mount package with commercial temperature grading.

Key Features

• Logic Capacity  Provides 17,280 logic elements and a 1,000,000-gate equivalent for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM to support buffering, state storage and local data handling without external memory.
• I/O and Connectivity  391 user I/O pins to support diverse peripheral interfaces and board-level routing requirements.
• Package and Mounting  Delivered in a 676-FBGA (27×27) package (676-BGA case) designed for surface-mount PCB assembly, balancing pin count and board area.
• Power  Operates from a device supply range of 1.14 V to 1.26 V to match system power rails and regulator choices.
• Operating Range and Grade  Commercial grade device rated for operation from 0 °C to 85 °C, suitable for standard ambient environments.
• RoHS Compliance  RoHS-compliant construction supporting regulatory and manufacturing requirements.

Typical Applications

• Prototyping and Development  Use the FPGA's logic and on-chip RAM for hardware validation, algorithm testing, and proof-of-concept implementations.
• Embedded Systems  Implement custom control logic, glue logic and peripheral interfaces using plentiful I/O and reconfigurable resources.
• Signal Processing and Data Handling  Leverage logic density and embedded RAM to implement packet processing, data buffering and custom datapaths.

Unique Advantages

• Substantial Logic Resource: 17,280 logic elements provide sufficient capacity for moderate-complexity FPGA designs without immediate need for external acceleration.
• On-Chip Memory: Approximately 0.44 Mbits of embedded RAM reduces dependency on external memory for local buffering and state storage.
• High I/O Count: 391 I/O pins enable flexible interfacing to multiple peripherals, buses and board-level connections.
• Compact BGA Footprint: 676-FBGA (27×27) package delivers high pin density in a compact surface-mount form factor for space-constrained boards.
• Predictable Power Envelope: Defined supply range (1.14 V to 1.26 V) simplifies power-supply planning and regulator selection.
• Regulatory Compatibility: RoHS compliance eases integration into manufacturing flows that require lead-free components.

Why Choose XC3S1000-5FGG676C?

The XC3S1000-5FGG676C positions itself as a practical choice for designers needing a commercial-grade, reconfigurable device with a balanced mix of logic, memory and I/O. Its combination of 17,280 logic elements, about 0.44 Mbits of embedded RAM and 391 I/O in a 676-FBGA package supports a wide range of embedded and prototyping applications where board space and I/O flexibility matter.

For teams seeking predictable supply requirements, the defined 1.14 V to 1.26 V operating range and RoHS compliance simplify integration into standard production environments. Its specifications make it suitable for development engineers and procurement looking for a reliable, mid-density FPGA option backed by AMD Spartan®-3 architecture.

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