XC3S1000L-4FGG320C

The XC3S1000L-4FGG320C is a Spartan®-3L field programmable gate array (FPGA) from AMD supplied in a 320-ball BGA package. It delivers a balanced combination of programmable logic, embedded memory, and I/O density for designs that require on-chip logic integration and flexible interfacing.

With 17,280 logic elements and approximately 0.42 Mbits of embedded memory, this commercial-grade device is positioned for applications that need significant on-chip resources within a compact surface-mount package and a controlled commercial temperature range.

Key Features

• Logic Capacity — 17,280 logic elements provide substantial programmable logic for custom digital designs and system integration tasks.
• Embedded Memory — Approximately 0.42 Mbits (442,368 bits) of on-chip RAM for packet buffers, FIFOs, and temporary storage without external memory.
• I/O Density — 221 user I/O pins to support multiple interfaces, parallel buses, and peripheral connections.
• Gate Count — Approximately 1,000,000 gates offering a measure of overall device complexity and routing capability.
• Power Supply — Core voltage range of 1.14 V to 1.26 V to match low-voltage system designs.
• Package and Mounting — 320-BGA (320-FBGA, 19×19) package in a surface-mount form factor for compact PCB layouts.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation, suitable for standard commercial applications.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly.

Typical Applications

• Embedded Logic Integration — Implement custom control and glue logic where on-chip resources reduce external components and simplify board-level designs.
• Interface Bridging — Aggregate and translate between multiple digital interfaces using the device’s high I/O count and programmable logic.
• Prototyping and Evaluation — Use the FPGA’s substantial logic and memory resources for proof-of-concept designs and algorithm validation.

Unique Advantages

• Significant On-Chip Resources: 17,280 logic elements and approximately 0.42 Mbits of embedded RAM enable complex functions without extensive external components.
• High I/O Count: 221 I/O pins provide flexibility for connecting peripherals, sensors, and parallel interfaces directly to the FPGA.
• Compact Surface-Mount Packaging: The 320-BGA (19×19) package supports high-density PCB layouts while maintaining a small footprint.
• Low-Voltage Core Support: Operates from a 1.14 V to 1.26 V core supply to align with low-voltage system designs.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C for deployment in standard commercial environments.
• RoHS Compliance: Supports lead-free assembly requirements for many production programs.

Why Choose XC3S1000L-4FGG320C?

The XC3S1000L-4FGG320C FPGA combines a substantial logic fabric, meaningful on-chip RAM, and a large number of I/O in a compact 320-BGA surface-mount package. Manufactured by AMD, it is suitable for designers seeking a programmable platform that balances logic capacity, memory, and interface flexibility within a commercial temperature range.

This device is a practical choice for projects that require integrated logic and memory resources to reduce bill-of-materials and simplify board-level design while maintaining RoHS compliance and standard commercial operating conditions.

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