XC3S1000L-4FGG676C

The XC3S1000L-4FGG676C is a Spartan®-3L field-programmable gate array from AMD, provided in a compact 676-BGA surface-mount package. It combines 480 CLBs (17,280 logic elements), approximately 0.44 Mbits of embedded memory, and 391 I/O pins to support mid-range, I/O-dense digital logic implementations.

Designed for commercial-grade projects, the device operates over a 0 °C to 85 °C range and uses a low-voltage core supply between 1.14 V and 1.26 V, offering a balance of integration density and I/O capacity in a space-efficient package.

Key Features

• Core & Logic  480 CLBs providing 17,280 logic elements for implementing custom digital logic and moderate-complexity designs.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM to support buffering, small data storage and internal state machines.
• I/O Capacity  391 user I/O pins to support multiple interfaces and high channel-count connectivity in a single device.
• Logic Gate Count  1,000,000 gates of logic resources for mapping combinational and sequential circuits.
• Power & Voltage  Core supply range of 1.14 V to 1.26 V for compatibility with low-voltage power architectures.
• Package & Mounting  676-BGA (supplier package: 676-FBGA, 27×27) in a surface-mount form factor for compact board layouts.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to meet common environmental directives for electronic components.

Typical Applications

• Custom digital logic and prototyping  Implement mid-range programmable logic functions using the 17,280 logic elements and 480 CLBs for rapid design iterations.
• I/O-rich interface bridging  Use the 391 I/O pins to consolidate multiple interfaces or create high-channel-count front-ends on a single device.
• On-chip buffering and state storage  Leverage approximately 0.44 Mbits of embedded memory for small FIFOs, buffers, and local data storage needs.
• Compact surface-mount designs  Deploy the 676-BGA package for space-constrained PCBs requiring a high-density FPGA solution.

Unique Advantages

• Balanced logic and I/O density: Combines 17,280 logic elements with 391 I/O pins to address designs that need both logic resources and significant external connectivity.
• Compact packaging: 676-FBGA (27×27) package enables dense board integration while maintaining a large I/O count.
• Low-voltage core operation: Core supply range of 1.14 V to 1.26 V fits modern low-voltage power architectures.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for standard commercial electronic applications.
• Regulatory alignment: RoHS compliance supports environmental requirements for a wide range of markets.

Why Choose XC3S1000L-4FGG676C?

The XC3S1000L-4FGG676C occupies a practical mid-range position within the Spartan®-3L family, offering a measured combination of logic density, embedded memory, and extensive I/O in a compact 676-BGA package. Its specification set fits projects that require moderate programmable logic resources alongside substantial external connectivity while maintaining commercial-grade operating conditions.

This device is well suited for engineers and teams seeking a surface-mount FPGA solution with approximately 17,280 logic elements, 391 I/O pins, and on-chip memory for localized buffering—delivering integration and configurability for a variety of standard electronic designs.

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