XC3S1000-5FG676C

The XC3S1000-5FG676C is a Spartan®-3 field programmable gate array (FPGA) from AMD supplied in a 676-ball BGA package. It delivers a balance of programmable logic, on-chip RAM, and abundant I/O for commercial embedded designs requiring mid-range integration and flexibility.

Key attributes include 17,280 logic elements, approximately 0.44 Mbits of embedded memory, and 391 user I/O pins, making it suitable for designs that need moderate gate capacity and extensive connectivity within a surface-mount, commercial-grade package.

Key Features

• Core Architecture  Spartan®-3 FPGA architecture in an XC3S1000 device offering 1,000,000 gates for programmable digital logic implementation.
• Logic Resources  1,920 configurable logic blocks (CLBs) and 17,280 logic elements provide the capacity to implement medium-complexity state machines, glue logic, and custom datapaths.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM to support buffering, small FIFOs, and local storage for processing tasks.
• I/O Density  391 user I/O pins to interface with multiple peripherals, sensors, and buses from a single device.
• Package and Mounting  676-ball BGA (supplier package: 676-FBGA, 27×27) designed for surface-mount assembly, supporting compact board layouts.
• Power  Supported core voltage range from 1.14 V to 1.26 V to match system power rails and power-budgeting needs.
• Operating Range  Commercial grade device specified for 0 °C to 85 °C operation for typical commercial environment deployments.
• Regulatory  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Commercial Embedded Systems  Use as the programmable logic heart of mid-range embedded products where 17,280 logic elements and 391 I/Os enable complex control and interfacing functions.
• System Integration & Glue Logic  Ideal for consolidating discrete interfaces and implementing glue logic between controllers, sensors, and peripherals thanks to high I/O count.
• Prototyping and Development  A platform for validating digital logic and custom hardware algorithms prior to production, leveraging on-chip RAM for temporary data storage.
• Data Aggregation and Preprocessing  Suitable for collecting and pre-processing multiple input streams with available logic resources and embedded memory.

Unique Advantages

• Balanced Logic and Memory:  17,280 logic elements paired with approximately 0.44 Mbits of RAM provide a practical mix of combinational and storage resources for mid-level designs.
• High I/O Count:  391 user I/Os reduce the need for external multiplexing or expanders, simplifying board-level design and lowering BOM.
• Compact BGA Package:  676-ball FBGA (27×27) enables high-density board implementations while supporting surface-mount assembly workflows.
• Commercial Temperature Rating:  Specified 0 °C to 85 °C operation aligns with a wide range of commercial product environments.
• Low-Level Power Window:  Core supply range of 1.14 V to 1.26 V supports designs with defined power-rail architectures and budgeting.
• RoHS Compliant:  Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose XC3S1000-5FG676C?

The XC3S1000-5FG676C positions itself as a practical, commercially graded FPGA solution for designers needing a blend of logic capacity, embedded memory, and generous I/O in a compact BGA footprint. Its one-million-gate class capability and substantial I/O make it well suited to developers consolidating functions on a single programmable device.

This device is a fit for engineering teams building commercial embedded systems, prototype platforms, and designs where moderate logic density, local RAM, and broad connectivity deliver project-level efficiency and reduced component count.

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