XC3S100E-5TQ144C

The XC3S100E-5TQ144C is a Spartan®-3E field programmable gate array (FPGA) in a 144-lead LQFP package. It provides 240 CLBs (2160 logic elements), 73,728 bits of on-chip RAM, and 108 user I/O pins for designs needing moderate programmable logic capacity in a surface-mount commercial-grade package.

Key device-level parameters include a core supply range of 1.14 V to 1.26 V, a commercial operating temperature range of 0 °C to 85 °C, and a total gate count of 100,000, enabling predictable resource planning for mid-density logic implementations.

Key Features

• Core Logic 240 configurable logic blocks (CLBs) delivering 2,160 logic elements to implement combinational and sequential logic functions.
• On-Chip Memory 73,728 bits of embedded RAM available for buffering, small data storage, and control state machines.
• I/O 108 user I/O pins to support multiple external signal connections and peripheral interfaces.
• Gate Count Approximately 100,000 gates for sizing and partitioning moderate-complexity logic designs.
• Power Core voltage supply specified from 1.14 V to 1.26 V to match system power-rail planning.
• Package & Mounting 144-lead LQFP package (supplier device package listed as 144-TQFP, 20×20) in a surface-mount form factor for PCB assembly.
• Temperature & Grade Commercial operating range of 0 °C to 85 °C; design and procurement decisions can reflect commercial-grade suitability.
• Environmental Compliance RoHS compliant to support lead-free assembly processes and regulatory requirements.

Typical Applications

• Programmable Logic Prototyping — Use the 240 CLBs and 2,160 logic elements to prototype and validate mid-density digital logic and control functions.
• I/O-Driven Interfaces — The 108 user I/O pins support designs requiring multiple external connections for sensors, peripherals, or interface logic.
• On-Chip Data Buffering — 73,728 bits of embedded RAM provide local storage for small FIFOs, lookup tables, or temporary buffering within control paths.

Unique Advantages

• Balanced Logic Capacity: 2,160 logic elements and 240 CLBs provide a mid-range resource set that fits many moderate-complexity designs without excessive overhead.
• Integrated Memory Resources: 73,728 bits of on-chip RAM reduce the need for external memory in applications with modest buffering or state storage requirements.
• Ample I/O Count: 108 user I/O pins enable multiple peripheral connections and flexible board-level integration.
• Compact Surface-Mount Package: 144-LQFP (supplier 144-TQFP, 20×20) allows for dense PCB layouts while remaining compatible with standard assembly processes.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to match commercial product deployment and testing profiles.
• Regulatory Readiness: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose XC3S100E-5TQ144C?

The XC3S100E-5TQ144C positions itself as a pragmatic choice for designers needing a commercially graded FPGA with moderate logic density, integrated RAM, and a substantial I/O count in a standard 144-LQFP surface-mount package. Its defined core voltage window and specified operating temperature simplify power and thermal planning for board-level designs.

This device is well suited for projects that require predictable, mid-range programmable logic resources and straightforward package integration. Its combination of logic elements, on-chip RAM, and I/O capacity offers a clear resource profile for teams planning PCB layouts, resource allocation, and BOM consolidation.

Request a quote or submit an inquiry to obtain current pricing, availability, and lead-time information for the XC3S100E-5TQ144C. Our team can provide the details you need to move your design forward.