XC3S1200E-4FG320I

The XC3S1200E-4FG320I is a Spartan®-3E Field Programmable Gate Array (FPGA) manufactured by AMD, supplied in a 320-ball BGA package for surface-mount assembly. It provides a balance of on-chip logic, embedded memory, and I/O capacity targeted for industrial-grade programmable logic implementations.

Key device attributes include 19,512 logic elements, approximately 0.52 Mbits of on-chip RAM, support for 250 I/O pins, a 1.14–1.26 V core supply range, and an industrial operating temperature range from −40 °C to 100 °C.

Key Features

• Core Logic  19,512 logic elements (and 2,168 CLBs) for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 0.52 Mbits of total on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O Capacity  250 user I/O pins to support a wide range of external interfaces and peripheral connections.
• Performance Metric  Programmable device equivalent of 1,200,000 gates for medium-density logic integration.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match target system power domains.
• Package & Mounting  320-BGA (320-FBGA, 19×19) in a surface-mount footprint for compact, high-density PCB layouts.
• Industrial Temperature Grade  Qualified for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance  RoHS compliant for environmental regulatory conformity.

Typical Applications

• Industrial Control  Industrial-grade temperature range and robust logic capacity make this FPGA suitable for programmable control and automation modules.
• High-density I/O Systems  With 250 I/O pins, the device fits designs requiring numerous external sensor, actuator, or communication interfaces.
• Embedded Logic and Glue  The combination of 19,512 logic elements and on-chip RAM supports on-board protocol bridging, control state machines, and custom logic functions.
• Compact, Surface-mount Designs  320-BGA packaging enables compact PCB integration where board area and pin density are important.

Unique Advantages

• Highly integrated logic capacity: 19,512 logic elements provide substantial programmable resources for consolidated digital designs, reducing external component count.
• Embedded memory for local storage: Approximately 0.52 Mbits of on-chip RAM enables efficient buffering and small data structure retention without external memory.
• Generous I/O count: 250 user I/Os accommodate complex interfacing requirements and multiple parallel connections.
• Industrial-temperature operation: Rated from −40 °C to 100 °C to match harsher deployment environments and extended-temperature applications.
• Compact BGA footprint: 320-FBGA (19×19) surface-mount package supports high-density PCB layouts and reliable soldered connections.
• Lead-free compliance: RoHS status ensures adherence to common environmental regulations.

Why Choose XC3S1200E-4FG320I?

The XC3S1200E-4FG320I positions itself as an industrial-grade Spartan®-3E FPGA offering a balanced set of programmable logic resources, embedded memory, and a high I/O count in a compact 320-BGA package. Its 1.14–1.26 V core voltage range and extended operating temperature range make it suitable for designs that require reliable performance in demanding environments.

Engineers and procurement teams seeking a mid-density FPGA from AMD with defined logic capacity, on-chip RAM, and broad I/O support will find this device appropriate for consolidating digital functions, reducing BOM complexity, and enabling compact surface-mount implementations.

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