XC3S1200E-4FGG320C

The XC3S1200E-4FGG320C is a Spartan®-3E Field Programmable Gate Array (FPGA) by AMD designed as a surface-mount, commercial-grade programmable logic device. It integrates 19,512 logic elements with approximately 0.516 Mbits of embedded memory and provides up to 250 user I/O in a 320-BGA (320-FBGA, 19×19) package.

Key device parameters include a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, making it suitable for a wide range of commercial embedded designs that require mid-range logic density and on-chip memory.

Key Features

• Core Logic — 19,512 logic elements supporting a total of 2,168 CLBs, enabling substantial combinational and sequential logic integration on a single device.
• Embedded Memory — Approximately 0.516 Mbits of on-chip RAM for buffering, state storage, and small data tables without external memory.
• I/O Capacity — Up to 250 user I/O pins to interface with peripherals, sensors, and bus interfaces directly from the FPGA fabric.
• Gate Count — Approximately 1.2 million gates for implementing mid-range digital functions and custom logic blocks.
• Package & Mounting — 320-BGA (supplier device package: 320-FBGA 19×19) surface-mount package for compact PCB integration.
• Power Supply — Core voltage range of 1.14 V to 1.26 V for power budgeting and regulator selection.
• Temperature & Grade — Commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Unique Advantages

• Mid-range logic density: 19,512 logic elements and ~1.2M gates provide a balance between capability and cost for designs needing substantial programmable logic without high-end FPGA complexity.
• On-chip memory integration: Approximately 0.516 Mbits of embedded RAM reduces reliance on external memory for buffering and small data storage, simplifying BOM and board layout.
• High I/O count in compact package: 250 I/Os in a 320-BGA footprint enable dense connectivity while keeping board area modest.
• Commercial-grade suitability: 0 °C to 85 °C operating range aligned with typical commercial embedded applications and development environments.
• Surface-mount, industry-standard package: 320-FBGA (19×19) supports automated assembly and standard PCB processes.
• Regulatory and environmental compliance: RoHS compliant to meet common environmental requirements for commercial products.

Why Choose XC3S1200E-4FGG320C?

The XC3S1200E-4FGG320C positions itself as a practical choice for designers who need mid-range programmable logic capability with integrated memory and plentiful I/O in a compact BGA package. Its combination of 19,512 logic elements, approximately 0.516 Mbits of on-chip RAM, and roughly 1.2 million gates supports a wide range of commercial embedded implementations where integration and board-level density matter.

Backed by AMD's Spartan®-3E family lineage, this device is suited to teams and projects that prioritize a balance of resources, package size, and compliance with commercial environmental requirements. Its defined voltage and temperature ranges make it straightforward to specify for production designs and procurement.

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