XC3S1200E-4FG320C

The XC3S1200E-4FG320C is a Spartan®-3E family FPGA in a 320-ball BGA package, offering a balance of logic capacity, on-chip memory and I/O density for commercial electronic designs. The device provides 19,512 logic elements across 2,168 configurable logic blocks (CLBs), approximately 0.516 Mbits of embedded RAM, and 250 user I/O pins to support complex digital integration on-board.

Key electrical and environmental parameters include a supply voltage range of 1.14 V to 1.26 V and a commercial operating temperature range of 0 °C to 85 °C. The part is RoHS compliant and supplied in a 320-FBGA (19×19) surface-mount package.

Key Features

• Core Logic — 2,168 CLBs providing a total of 19,512 logic elements for implementing custom digital functions and state machines.
• Embedded Memory — Approximately 0.516 Mbits of on-chip RAM available for FIFOs, buffers, and lookup tables.
• I/O Capacity — 250 user I/O pins to support parallel interfaces, external peripherals and glue-logic integration.
• Gate Count — Approximately 1,200,000 gates enabling substantial integration of combinational and sequential logic.
• Power — Operates from a supply voltage range of 1.14 V to 1.26 V to match low-voltage digital domains.
• Package and Mounting — 320-FBGA (19×19) package in a surface-mount form factor for compact board layouts.
• Temperature and Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital designs — Implement complex control logic and parallel datapaths using the 19,512 logic elements and ~1.2M gate capacity.
• Memory buffering and small data storage — Leverage approximately 0.516 Mbits of on-chip RAM for FIFOs, frame buffers or lookup tables.
• I/O-intensive interface logic — Use the 250 I/O pins to implement parallel interfaces, protocol bridging, and board-level glue logic.
• Low-voltage digital systems — Deploy in designs operating within the 1.14 V to 1.26 V supply range.

Unique Advantages

• High logic density: 19,512 logic elements and 2,168 CLBs enable integration of sizable custom digital functions on a single device.
• Significant embedded RAM: Approximately 0.516 Mbits of on-chip memory reduces dependence on external memory for small buffering and table storage.
• Large I/O complement: 250 user I/O pins provide flexibility for multiple interfaces and peripheral connections without external multiplexing.
• Compact BGA package: The 320-FBGA (19×19) package supports denser PCB designs while maintaining extensive pin count.
• Commercial temperature range: Rated for 0 °C to 85 °C to match standard commercial deployments.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose XC3S1200E-4FG320C?

The XC3S1200E-4FG320C delivers a practical combination of logic capacity, embedded memory and I/O density in a surface-mount 320-FBGA package for commercial embedded designs. Its fixed supply voltage range and commercial temperature rating make it suitable for systems where predictable electrical and environmental characteristics are required.

This device is well suited to engineers and system designers who need to consolidate custom digital logic, buffering and multiple interfaces into a single FPGA platform while maintaining a compact board footprint and RoHS compliance.

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