XC3S100E-5TQG144C

The XC3S100E-5TQG144C is a Spartan®-3E field programmable gate array from AMD, offered in a 144-LQFP package. It provides a compact, surface-mount FPGA option combining programmable logic, embedded RAM, and a moderate I/O count for a range of commercial electronic designs.

Designed for applications that require on-chip configurable logic and interfacing, the device delivers 2,160 logic elements across 240 CLBs, approximately 73,728 bits of embedded memory, and 108 user I/Os while operating within a 1.14 V to 1.26 V supply range and a commercial temperature window of 0 °C to 85 °C.

Key Features

• Core Logic 240 CLBs yielding 2,160 logic elements (cells) and an estimated 100,000 gates for implementing custom digital logic and state machines.
• Embedded Memory Approximately 73,728 bits of on-chip RAM to support FIFOs, small buffers, and local data storage without external memory.
• I/O Capacity 108 user I/O pins suitable for cross-domain interfacing, peripheral control, and bus bridging in compact designs.
• Package & Mounting 144-LQFP surface-mount package (supplier device package: 144-TQFP, 20×20) for PCB-level integration in constrained footprints.
• Power & Operating Range Core supply range of 1.14 V to 1.26 V and commercial operating temperature from 0 °C to 85 °C for standard commercial applications.
• Regulatory RoHS compliant, supporting lead-free assembly and environmentally conscious manufacturing.

Typical Applications

• Embedded Control Use the FPGA’s 2,160 logic elements and embedded RAM to implement control logic, state machines, and glue logic in embedded systems.
• Interface Bridging With 108 I/Os, the device is suitable for bridging or adapting signals between peripherals and system buses on compact PCBs.
• Prototyping and Development A surface-mount 144-LQFP package and moderate logic capacity make it useful for early prototyping of FPGA-based functions in commercial products.
• Local Data Processing Embedded RAM and programmable logic can be combined to implement small-scale data buffering, preprocessing, or control algorithms on-chip.

Unique Advantages

• Balanced Logic and I/O Combines 2,160 logic elements with 108 I/Os to support designs that require both moderate compute and plentiful external connectivity.
• On-chip Memory Availability Approximately 73,728 bits of embedded RAM reduce dependency on external memory for small buffers and FIFO implementations.
• Compact Surface-Mount Package The 144-LQFP (144-TQFP, 20×20) package enables board-level integration where board space is limited.
• Predictable Operating Envelope Defined core voltage range (1.14 V–1.26 V) and commercial temperature rating (0 °C–85 °C) simplify power and thermal planning for commercial designs.
• RoHS Compliant Supports lead-free manufacturing processes and regulatory requirements for many commercial product lines.

Why Choose XC3S100E-5TQG144C?

The XC3S100E-5TQG144C positions itself as a practical Spartan-3E FPGA option for commercial electronic designs that need a mix of programmable logic, embedded memory, and flexible I/O in a compact surface-mount package. Its combination of 240 CLBs (2,160 logic elements), approximately 73,728 bits of embedded RAM, and 108 I/Os provides designers with the resources to implement custom digital functions, interface logic, and small on-chip data structures without immediately resorting to larger devices.

Manufactured by AMD and supplied in a 144-LQFP package, the device is suited for teams and projects seeking predictable electrical and thermal parameters and RoHS-compliant components for commercial product development.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the XC3S100E-5TQG144C. Our team can assist with ordering and delivery details tailored to your project needs.