XC3S1200E-4FG400C

The XC3S1200E-4FG400C is a Spartan®-3E family Field Programmable Gate Array (FPGA) provided in a 400-ball BGA package. It offers a balance of programmable logic resources, on-chip memory, and a high I/O count targeted at commercial electronic designs.

With 19,512 logic elements, approximately 0.516 Mbits of embedded memory and 304 I/O, this device is suited for designs that require flexible, reconfigurable digital logic in a compact surface-mount package while operating within a commercial temperature range.

Key Features

• Logic Capacity  Provides 19,512 logic elements supporting a wide range of user-defined digital functions and state machines.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM for buffering, FIFOs, and small data storage needs.
• I/O Resources  304 user I/O pins enable broad interfacing options with external peripherals and subsystems.
• Gate Count  Contains 1,200,000 gates to support complex combinational and sequential logic implementations.
• Power Supply  Nominal core voltage range of 1.14 V to 1.26 V for core power sequencing and system design.
• Package & Mounting  Supplied in a 400-FBGA (21×21) package, designed for surface-mount assembly.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliance  RoHS-compliant device suitable for environmentally conscious assemblies.

Typical Applications

• Custom digital logic and prototyping  Implement user-defined digital circuits, state machines, and logic prototypes that benefit from reconfigurability.
• I/O-intensive control  Use the 304 I/O pins for interfacing with sensors, buses, and peripheral devices in systems requiring many external connections.
• On-chip buffering and data handling  Leverage the embedded memory for small buffering, lookup tables, and temporary data storage within digital pipelines.
• Compact commercial equipment  Deploy in surface-mount, space-constrained assemblies where a BGA package and commercial temperature rating meet system needs.

Unique Advantages

• High logic density: 19,512 logic elements enable implementation of sizeable custom logic functions without external ASICs or CPLDs.
• Integrated memory: Approximately 0.516 Mbits of on-chip RAM reduces dependence on external memory for small-data buffering and control structures.
• Extensive I/O: 304 I/O pins provide flexibility for multi-channel interfacing and complex peripheral integration.
• Compact assembly-ready package: 400-FBGA (21×21) format supports surface-mount manufacturing and compact board layouts.
• Commercial temperature suitability: Rated 0 °C to 85 °C for designs targeting commercial applications and environments.
• Regulatory alignment: RoHS compliance supports environmentally regulated manufacturing and end-products.

Why Choose XC3S1200E-4FG400C?

The XC3S1200E-4FG400C delivers a balanced combination of logic resources, embedded memory, and I/O density in a compact 400-BGA package tailored for commercial-grade systems. Its specified voltage range and gate count make it appropriate for designers seeking a reconfigurable hardware building block with on-chip resources to minimize external components.

This FPGA is well suited for engineering teams developing medium-complexity digital designs that require flexibility, moderate on-chip memory, and broad interfacing capability—offering long-term design flexibility through reprogrammability and conservative commercial operating specifications.

Request a quote or submit an inquiry today to obtain pricing and availability for the XC3S1200E-4FG400C. Our team can provide the next steps for procurement and delivery.