XC3S1200E-4FG400I

The XC3S1200E-4FG400I is a Spartan®-3E field programmable gate array (FPGA) IC from AMD, delivered in a 400‑ball BGA package. It provides a mid-density programmable logic fabric with 19,512 logic elements and approximately 1.2 million equivalent gates, combined with on-chip embedded memory and a high I/O count.

Designed for industrial-grade applications, this device offers a compact 400‑FBGA (21×21) surface-mount package, a core supply range of 1.14 V to 1.26 V, and an operating temperature range of −40 °C to 100 °C—attributes that support integration into systems requiring robust logic capacity and significant I/O connectivity.

Key Features

• Core Logic 19,512 logic elements and approximately 1,200,000 equivalent gates provide mid-density programmable logic capacity for custom digital designs.
• On‑chip Memory Approximately 0.52 Mbits of embedded RAM for buffering, FIFOs, and small data stores within the programmable fabric.
• I/O and Package 304 general-purpose I/O pins in a compact 400‑BGA package; supplier device package specified as 400‑FBGA (21×21) for high pin-count integration in space-constrained boards.
• Power Core supply operating range of 1.14 V to 1.26 V to match typical low-voltage FPGA power architectures.
• Industrial Reliability Industrial-grade part with an operating temperature range of −40 °C to 100 °C and surface-mount mounting type for standard manufacturing processes.
• Regulatory RoHS compliant, supporting environmentally conscious manufacturing and product design.

Typical Applications

• Industrial Control Use in control and automation systems where industrial temperature range and robust logic capacity are required.
• I/O‑Intensive Interfaces High pin count (304 I/Os) enables consolidation of multiple parallel and serial interfaces on a single FPGA.
• Embedded Data Path and Buffering On-chip RAM (approximately 0.52 Mbits) supports local buffering and small data-storage needs within signal-processing pipelines.
• Mid‑Density Logic Integration Suitable for designs that require around 19,512 logic elements to implement custom finite-state machines, glue logic, and peripheral controllers.

Unique Advantages

• Highly integrated logic capacity: 19,512 logic elements reduce the need for multiple discrete devices, simplifying board design.
• High I/O density: 304 I/Os allow multiple interfaces and peripherals to be connected directly to the FPGA, minimizing external multiplexing.
• On‑chip memory for local buffering: Approximately 0.52 Mbits of embedded RAM enables compact data handling without external memory.
• Industrial temperature operation: Rated from −40 °C to 100 °C for deployment in thermally demanding environments.
• Compact BGA packaging: 400‑FBGA (21×21) provides a high pin count in a surface-mount form-factor optimized for space-constrained PCBs.
• RoHS compliant: Meets lead-free manufacturing requirements for environmentally compliant products.

Why Choose XC3S1200E-4FG400I?

The XC3S1200E-4FG400I positions itself as a solid mid-density FPGA choice for designs that require substantial programmable logic, significant I/O capacity, and on‑chip memory, all within a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-life and environmentally conscious products.

This device is appropriate for engineers and procurement teams looking for a dependable FPGA solution for industrial control, I/O consolidation, and embedded logic tasks where a balance of logic resources, memory, and I/O is required.

Request a quote or submit an inquiry to receive pricing and availability information for XC3S1200E-4FG400I and to begin the procurement process.