XC3S1200E-4FGG320I

The XC3S1200E-4FGG320I is a Spartan®-3E Field Programmable Gate Array (FPGA) IC from AMD supplied in a 320‑BGA package. It provides reprogrammable logic resources with 19,512 logic elements, approximately 0.516 Mbits of embedded memory, and up to 250 user I/Os for industrial designs.

Designed for industrial environments, the device combines a compact 320‑FBGA (19×19) package and a core voltage range of 1.14 V to 1.26 V with an operating temperature span from -40 °C to 100 °C, offering a balance of integration density and environmental tolerance.

Key Features

• Logic Capacity  Approximately 19,512 logic elements enabling medium-density programmable logic implementations.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffering, FIFOs, and localized data storage.
• I/O Count  Up to 250 user I/Os to support multiple parallel interfaces and signal routing in compact designs.
• Gate Count  Around 1,200,000 gates for implementing combinational and sequential logic functions.
• Power and Core Voltage  Core supply voltage range of 1.14 V to 1.26 V for the FPGA core domain.
• Package and Mounting  320‑BGA (320‑FBGA, 19×19) surface-mount package for space-efficient PCB integration.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C to meet industrial environment requirements.
• Compliance  RoHS compliant for lead-free assembly processes.

Typical Applications

• Industrial Control  Use the FPGA for programmable logic, I/O aggregation and protocol handling in industrial automation systems that require industrial temperature operation.
• Embedded Systems  Integrate custom logic, buffering and interface glue logic using the on-chip memory and abundant I/Os in compact board designs.
• Communication Interfaces  Implement parallel and serial interface logic leveraging up to 250 I/Os for board-level connectivity and signal multiplexing.

Unique Advantages

• High Logic Density:  19,512 logic elements provide substantial on-chip programmable resources for medium-complexity designs.
• On-Chip Memory:  Approximately 0.516 Mbits of embedded RAM reduces the need for external memory for many buffering and control tasks.
• Generous I/O Count:  Up to 250 I/Os supports multiple interfaces and parallel signal paths, helping to reduce external logic.
• Industrial Temperature Rating:  Operation from -40 °C to 100 °C supports deployment in harsher environments.
• Compact, Surface-Mount Package:  320‑FBGA (19×19) package enables dense PCB layouts while maintaining robust mounting.
• RoHS Compliant:  Compliant status supports lead-free manufacturing and environmental requirements.

Why Choose XC3S1200E-4FGG320I?

The XC3S1200E-4FGG320I positions itself as a mid-density, industrial-grade FPGA solution from AMD, combining substantial logic capacity, embedded RAM, and a high I/O count in a compact 320‑BGA package. Its operating temperature range and RoHS compliance make it suitable for industrial applications where package density and environmental tolerance matter.

This device is well suited for engineers and procurement teams designing embedded systems, industrial control hardware, or board-level interface logic who need a reprogrammable, documented FPGA solution with defined logic, memory and I/O resources.

Request a quote or submit an inquiry to purchase the XC3S1200E-4FGG320I and discuss availability and pricing for your volume requirements.