XC3S1200E-4FT256C

The XC3S1200E-4FT256C is a Spartan®-3E family FPGA from AMD, offered in a 256-ball LBGA package and intended for commercial applications. It provides a mid-range programmable logic resource set with measurable on-chip memory, a substantial I/O count and a compact surface-mount footprint.

Designers can leverage its 19,512 logic elements, approximately 0.516 Mbits of embedded memory and 190 user I/O pins for a range of commercial embedded and programmable-logic tasks where board-level integration and deterministic supply/temperature requirements are important.

Key Features

• Core Logic  Provides 19,512 logic elements (cells) and approximately 1,200,000 equivalent gates for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM (516,096 bits) to support buffering, FIFOs and small data tables without external memory.
• I/O Capacity  Up to 190 user I/O pins to interface with peripherals, sensors and external logic devices.
• Power Supply  Core supply range of 1.14 V to 1.26 V to match system power rails and ensure stable operation within specified limits.
• Package & Mounting  Supplied in a 256-LBGA package (supplier package: 256-FTBGA, 17×17) and designed for surface-mount assembly.
• Operating Conditions  Commercial grade device rated for operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

• Commercial embedded systems  Implement control logic, protocol handling or peripheral integration using 19,512 logic elements and built-in RAM for local buffering.
• Custom I/O and bridging  Use up to 190 I/O pins to bridge between interfaces or consolidate multiple peripheral signals in a compact LBGA package.
• Cost-sensitive programmable logic  Deploy programmable hardware acceleration or glue logic in designs where surface-mount assembly and commercial temperature range are appropriate.

Unique Advantages

• Substantial logic capacity: 19,512 logic elements allow implementation of medium-complexity designs without external FPGA partitioning.
• On-chip memory for local buffering: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for many control and data-path tasks.
• High I/O count: 190 user I/Os accommodate multiple peripherals and interfaces directly on the FPGA package.
• Compact, surface-mount package: 256-LBGA (256-FTBGA, 17×17) supports high-density board layouts while maintaining a small PCB footprint.
• Commercial-grade operating range: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial product deployments.
• Defined core supply window: Core voltage specified from 1.14 V to 1.26 V for clear power-supply design and system integration.

Why Choose XC3S1200E-4FT256C?

The XC3S1200E-4FT256C balances a significant logic element count, on-chip RAM and a high I/O count in a compact 256-ball LBGA surface-mount package, making it well-suited for commercial embedded designs that require programmable logic integration without excessive board space. Its specified supply and operating temperature range allow straightforward integration into commercial electronic products.

Manufactured by AMD and offered as a RoHS-compliant, commercial-grade FPGA, this device is aimed at designers seeking a measurable mix of logic, memory and I/O capacity in a compact form factor for medium-complexity programmable designs.

Request a quote or submit an inquiry for XC3S1200E-4FT256C to obtain pricing and availability for your next design or production run.