XC3S1200E-5FG400C

The XC3S1200E-5FG400C is a Spartan®-3E Field Programmable Gate Array (FPGA) IC from AMD. It integrates a substantial logic capacity with embedded memory and a high I/O count in a compact 400-FBGA package, designed for commercial-temperature embedded applications.

Key on-chip resources include approximately 19,512 logic elements, about 0.52 Mbits of embedded RAM, and 304 user I/O pins, enabling a balance of logic density, memory, and connectivity for a range of programmable digital designs.

Key Features

• Core Logic — Approximately 19,512 logic elements organized into 2,168 logic blocks, delivering up to 1,200,000 gates of programmable logic capacity.
• Embedded Memory — Approximately 0.52 Mbits of on-chip RAM to support buffering, state storage, and local data manipulation without external memory.
• I/O Resources — 304 user I/O pins to support multiple interface connections and system-level integration.
• Package & Mounting — 400-FBGA (21×21) package case in a surface-mount form factor for compact board-level integration.
• Power — Core supply range specified at 1.14 V to 1.26 V for predictable power design and supply planning.
• Temperature & Grade — Commercial-grade device specified for operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• Balanced integration: Combines significant logic capacity, embedded RAM, and a high I/O count in a single package, reducing the need for multiple discrete components.
• Compact package: 400-FBGA (21×21) footprint supports dense PCB layouts while maintaining a high pin count for system connectivity.
• Predictable power planning: Narrow core voltage range (1.14 V–1.26 V) simplifies power-supply design and voltage regulation choices.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match common embedded and commercial applications.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XC3S1200E-5FG400C?

The XC3S1200E-5FG400C provides a practical combination of logic density, embedded memory, and abundant I/O in a small-footprint 400-FBGA package from AMD. Its defined core voltage range, commercial temperature rating, and RoHS compliance make it suitable for designers seeking a verified FPGA building block for commercial embedded systems.

This device is well suited to projects that require a mid-range programmable logic solution with on-chip RAM and substantial I/O capability, offering a clear, specification-driven option for system designers and procurement teams focused on predictable integration and packaging.

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