XC3S1200E-5FT256C

The XC3S1200E-5FT256C is a Spartan®-3E field programmable gate array (FPGA) in a 256-LBGA package, supplied by AMD. It provides 19,512 logic elements, approximately 0.516 Mbits of embedded memory, and 190 I/O pins in a surface-mount footprint for commercial-grade digital designs.

With a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, this device targets commercial applications that require moderate on-chip logic density, on-chip RAM, and a compact BGA package while meeting RoHS compliance.

Key Features

• Core Logic — 19,512 logic elements provide a substantial resource pool for implementing custom digital logic, finite-state machines, and glue logic.
• Embedded Memory — Approximately 0.516 Mbits (516,096 bits) of on-chip RAM supports buffering, small look-up tables, and local data storage without external memory.
• I/O Density — 190 I/O pins enable connectivity to multiple peripherals, buses, and board-level interfaces within a single device.
• Gate Count — 1,200,000 gates for estimating design capacity and partitioning logic functions.
• Power — Operates from a 1.14 V to 1.26 V supply range, suitable for designs with low-voltage logic domains.
• Package & Mounting — Surface-mount 256-LBGA package (supplier device package: 256-FTBGA 17×17) for compact PCB integration.
• Commercial Grade & Temperature — Rated for commercial temperature operation from 0 °C to 85 °C for standard electronics environments.
• Environmental Compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Commercial digital systems — Use the XC3S1200E-5FT256C where on-chip logic capacity and embedded RAM enable integration of system control and data handling functions in a single FPGA.
• I/O-dense board designs — The 190 available I/O pins support multiple peripheral interfaces and board-level connectivity without requiring additional interface chips.
• Compact, surface-mount assemblies — The 256-LBGA (256-FTBGA 17×17) package fits tightly constrained PCB layouts while providing substantial logic resources.

Unique Advantages

• Substantial on-chip logic: 19,512 logic elements allow consolidation of multiple logic functions into one FPGA, reducing BOM complexity.
• Integrated memory: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for small buffers and lookup tables.
• High I/O count: 190 I/Os make it easier to route signals and interface directly with sensors, displays, or external controllers on the same board.
• Compact BGA package: 256-LBGA surface-mount package enables space-efficient board designs while maintaining a high pin count.
• Commercial temperature rating: 0 °C to 85 °C provides predictable operation across standard commercial operating environments.
• RoHS compliant: Meets common environmental requirements for modern production and assembly processes.

Why Choose XC3S1200E-5FT256C?

The XC3S1200E-5FT256C balances logic capacity, embedded memory, and I/O count in a compact 256-LBGA surface-mount package for commercial-grade digital designs. Its combination of 19,512 logic elements, approximately 0.516 Mbits of on-chip RAM, and 190 I/Os makes it suitable for engineers seeking integration and board-level consolidation without expanding the component count.

Backed by AMD manufacturing, this FPGA is positioned for customers developing commercial electronic products that require moderate logic density and reliable, RoHS-compliant components. Its voltage and temperature specifications support typical commercial designs while offering a clear baseline for system power and thermal planning.

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