XC3S1400A-4FG484C

The XC3S1400A-4FG484C is a Spartan®-3A family FPGA provided in a 484-ball BGA package for surface-mount assembly. It delivers a high-density programmable-logic fabric with commercial-grade qualification and on-chip resources suitable for a wide range of programmable-logic requirements in commercial electronic designs.

Key Features

• Logic Capacity  Provides 25,344 logic elements enabling complex combinational and sequential logic implementations and support for sizeable user-defined logic blocks.
• Gate Equivalent  Approximately 1,400,000 gates of logic capacity for medium- to high-complexity designs.
• Embedded Memory  Includes 589,824 bits of on-chip RAM (approximately 0.59 Mbits) to support data buffering, FIFOs, and small on-chip storage needs.
• I/O Resources  Offers 375 user I/O pins to interface with multiple peripherals, sensors, and external devices in compact system designs.
• Power Supply Range  Operates from a core voltage supply range of 1.14 V to 1.26 V, enabling compatibility with targeted power-rail designs.
• Package & Mounting  Supplied in a 484-BBGA package (supplier device package: 484-FBGA, 23×23) designed for surface-mount PCB assembly.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial-environment deployments.
• Regulatory Compliance  RoHS compliant, supporting lead-free manufacturing and regulatory requirements for many commercial products.

Typical Applications

• Commercial Embedded Systems  Implements custom logic, protocol handling, and glue-logic functions in commercial electronic products where programmable hardware is required.
• Prototyping and Development  Suitable for hardware prototyping and iterative design work that benefits from a reprogrammable logic platform with substantial logic and memory resources.
• Interface and I/O Aggregation  Provides flexible I/O resources to consolidate peripheral interfaces and perform signal conditioning or protocol bridging in commercial devices.

Unique Advantages

• Substantial Logic Density: 25,344 logic elements and roughly 1.4 million gate equivalents allow implementation of complex custom logic without immediate need for higher-tier devices.
• On-chip Memory: Approximately 0.59 Mbits of embedded RAM reduces external memory requirements for many buffering and control functions, simplifying BOM and layout.
• High I/O Count: 375 user I/Os enable broad interfacing options, reducing the need for external multiplexing or I/O expanders.
• Compact BGA Package: 484-ball BGA (484-FBGA, 23×23) provides a high-pin-count solution in a compact footprint suitable for space-constrained PCBs.
• Commercial Temperature Support: Rated for 0 °C to 85 °C, aligning with typical commercial-environment product requirements.
• RoHS Compliant: Supports lead-free assembly processes and regulatory compliance for many markets.

Why Choose XC3S1400A-4FG484C?

The XC3S1400A-4FG484C positions itself as a high-density, commercial-grade FPGA option that balances logic capacity, on-chip memory, and extensive I/O in a compact BGA package. Its combination of 25,344 logic elements, approximately 0.59 Mbits of embedded RAM, and 375 I/Os makes it well suited to designers seeking a reprogrammable, integrated solution for medium- to high-complexity commercial electronic designs.

This device is appropriate for teams and projects that require scalability and design flexibility with verifiable operating parameters—commercial temperature range, defined core voltage window, surface-mount BGA packaging, and RoHS compliance—to support production-ready implementations.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S1400A-4FG484C and explore how it can fit into your next commercial FPGA design.