XC3S1400A-4FG676I

The XC3S1400A-4FG676I is a Spartan®-3A field programmable gate array from AMD designed for industrial applications. It combines a high logic element count with substantial embedded memory and a large I/O complement to address demanding embedded logic and control tasks.

With 25,344 logic elements, approximately 0.59 Mbits of on-chip RAM, and 502 I/O pins in a 676-FBGA (27×27) package, this device targets designs that require dense logic integration, extensive I/O connectivity, and operation across a wide industrial temperature range.

Key Features

• Core Logic Density  25,344 logic elements provide significant programmable logic resources for implementing custom digital functions and state machines.
• Configurable Logic Blocks (CLBs)  2,816 CLBs for flexible logic partitioning and combinational/sequential logic implementation.
• Embedded Memory  Approximately 0.59 Mbits of total on-chip RAM (589,824 bits) to support buffering, FIFOs, and embedded data storage.
• I/O Capacity  502 user I/Os enable high pin-count designs and extensive external interfacing without external I/O expanders.
• Device Density  Approximately 1,400,000 gates to accommodate complex logic and integration of multiple functions on a single device.
• Power  Core voltage operating range of 1.14 V to 1.26 V to match board-level power architectures.
• Package & Mounting  676-FBGA (27×27) package in a surface-mount BGA case for compact board-level integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Uses the industrial temperature rating and high I/O count for control logic, sensor interfacing, and machine automation systems.
• Embedded System Glue Logic  Deploy as a customizable interface and protocol bridging device where on-chip RAM and programmable logic simplify integration.
• Communications and Networking  Leverage the logic density and I/O capacity to implement packet handling, protocol adaptation, and interface management.
• Test & Measurement  Apply the device for data acquisition front-ends and real-time signal processing that require predictable temperature performance and significant on-chip memory.

Unique Advantages

• High Logic Capacity: 25,344 logic elements and ~1.4 million gates enable integration of complex digital functions on a single FPGA, reducing BOM complexity.
• Substantial On-Chip Memory: Approximately 0.59 Mbits of embedded RAM supports buffering and local data storage without external memory.
• Large I/O Complement: 502 I/Os provide flexibility for multi-channel interfacing and direct connection to a broad range of peripherals and sensors.
• Industrial-Grade Operation: Rated from −40 °C to 100 °C for reliable operation in harsh industrial environments.
• Compact BGA Package: 676-FBGA (27×27) surface-mount package enables high-density board layouts while maintaining extensive pin availability.
• Controlled Core Voltage: Narrow supply window (1.14 V to 1.26 V) for predictable power design and system-level integration.

Why Choose XC3S1400A-4FG676I?

The XC3S1400A-4FG676I positions itself as a high-density, industrial-grade FPGA suitable for designs that demand substantial logic resources, significant embedded RAM, and expansive I/O capability in a compact BGA package. Its operating range and mounting options make it appropriate for industrial control, embedded interfacing, and communications applications.

For engineers and procurement teams seeking a robust programmable logic device with verifiable specifications—logic elements, RAM, I/O count, package, voltage range, and temperature rating—this Spartan®-3A device offers a clear, specification-driven platform to consolidate functionality and reduce system complexity.

Request a quote or submit your requirements to receive pricing and availability information for the XC3S1400A-4FG676I.