XC3S1400A-4FGG484I

The XC3S1400A-4FGG484I is a Spartan®-3A field programmable gate array (FPGA) in a 484-ball BGA package. It provides a programmable fabric with 25,344 logic elements, approximately 0.59 Mbits of embedded RAM, and up to 375 user I/O pins for dense digital integration.

Designed for industrial-grade applications, this surface-mount FPGA supports operation from -40 °C to 100 °C and a core supply range of 1.14 V to 1.26 V, offering a compact, high-capacity solution for complex custom logic implementations.

Key Features

• Logic Capacity — 25,344 logic elements enabling extensive custom combinational and sequential logic realization within a single device.
• Embedded Memory — Approximately 0.59 Mbits (589,824 bits) of on-chip RAM for buffering, FIFOs, and state storage without external memory.
• I/O Density — 375 user I/O pins to support high-connectivity designs and interfacing with peripherals and subsystems.
• Gate Count — 1,400,000 gates providing substantial integration for complex system functions.
• Package and Mounting — 484-ball BGA (supplier package: 484-FBGA, 23×23 mm) in a surface-mount form factor for compact board layouts.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system power rails and regulator designs.
• Operating Range — Industrial temperature grade with specified operation from -40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliant — Conforms to RoHS requirements for reduced hazardous substances.

Typical Applications

• Custom digital logic — Implement complex state machines, protocol handlers, and application-specific accelerators using 25,344 logic elements.
• Memory-intensive buffering — Use approximately 0.59 Mbits of embedded RAM for data buffering, packet queues, and temporary storage.
• I/O-heavy control systems — Support systems requiring many external interfaces with up to 375 user I/Os for sensors, actuators, and peripheral buses.

Unique Advantages

• Substantial integration density: 25,344 logic elements and 1.4M gates reduce the need for multiple discrete devices, simplifying board design.
• On-chip memory available: Approximately 0.59 Mbits of embedded RAM enables internal data buffering and state retention without external memory components.
• High I/O count: 375 user I/Os allow flexible interfacing and front-end connectivity for complex systems.
• Industrial temperature capability: Rated for -40 °C to 100 °C to meet the environmental demands of industrial deployments.
• Compact BGA footprint: 484-ball BGA (23×23 mm supplier package) supports space-constrained PCB layouts while providing robust connectivity.
• RoHS compliant: Meets environmental requirements for hazardous substance restrictions.

Why Choose XC3S1400A-4FGG484I?

The XC3S1400A-4FGG484I positions itself as a high-capacity, industrial-grade FPGA suitable for designs that require substantial logic resources, significant on-chip memory, and a large number of I/Os in a compact BGA package. Its combination of logic density, embedded RAM, and robust operating range makes it a compelling choice for embedded systems and control applications that demand reliable, integrated programmable logic.

For engineering teams and procurement seeking a surface-mount FPGA with measurable resource counts and industrial temperature support, this device delivers clear, verifiable specifications to plan around—enabling scalable, maintainable designs backed by established FPGA architecture.

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