XC3S1400A-4FTG256C

The XC3S1400A-4FTG256C is a Spartan®-3A field programmable gate array (FPGA) in a 256-LBGA package intended for commercial-grade applications. The device provides a substantial logic fabric and embedded memory, along with a broad I/O count and a defined supply voltage and operating temperature range for system-level integration.

Key Features

• Logic Capacity — Provides 25,344 logic elements to implement custom digital functions and state machines.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• Logic Blocks — 2,816 logic blocks available for structuring combinational and sequential logic.
• Gate Count — Equivalent to 1,400,000 gates for complex integration and glue-logic tasks.
• I/O — 161 user I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Power — Core supply voltage specified from 1.14 V to 1.26 V for predictable power design and sequencing.
• Package and Mounting — Supplied in a 256-LBGA package (supplier device package: 256-FTBGA, 17×17) and designed for surface-mount assembly.
• Temperature and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance — RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Custom digital logic and prototyping — Use the 25,344 logic elements and 2,816 logic blocks to implement and iterate complex digital designs.
• I/O-dense control systems — 161 I/Os enable flexible interfacing to sensors, peripherals, and board-level connectors.
• Embedded buffering and data handling — Approximately 0.59 Mbits of on-chip RAM supports buffering, small data stores, and FIFO implementations.

Unique Advantages

• Substantial logic resources: 25,344 logic elements and 1.4M-gate equivalence enable implementation of sizable custom logic and state machines without external ASICs.
• Integrated on-chip memory: Approximately 0.59 Mbits of embedded RAM reduces dependence on external memory for many buffering and control tasks.
• High I/O count: 161 user I/Os provide flexibility for multi-interface designs and board-level integration.
• Defined power envelope: Core voltage range of 1.14 V to 1.26 V supports consistent power design and sequencing strategies.
• Commercial temperature rating: Rated for 0 °C to 85 °C to match a wide range of commercial applications.
• RoHS compliant: Meets environmental compliance requirements for many assembly processes and product lines.

Why Choose XC3S1400A-4FTG256C?

The XC3S1400A-4FTG256C balances abundant logic resources, embedded memory, and a high I/O count in a surface-mount 256-LBGA package for commercial designs that require significant on-chip integration. Its defined core voltage range and commercial temperature rating make it suitable for board-level systems where predictable power and environmental behavior are important.

This part is well suited for engineering teams implementing mid-range FPGA-based logic, system glue, or I/O aggregation where the combination of logic capacity, on-chip RAM, and I/O density delivers a compact, integrated solution with RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability details for the XC3S1400A-4FTG256C and to discuss how it can fit into your next design.