XC3S1400A-5FGG676C

The XC3S1400A-5FGG676C is a Spartan®-3A field programmable gate array (FPGA) from AMD, provided in a 676-ball BGA package. It delivers a programmable logic fabric with substantial on-chip memory and a high count of I/O for designs that require flexible, reconfigurable digital logic in a compact surface-mount package.

Key Features

• Logic Capacity  25,344 logic elements provide the core programmable resources for implementing custom digital functions and parallel processing pipelines.
• Configurable Logic Blocks  2,816 configurable logic blocks (CLBs) enable structured logic design and partitioning within the FPGA fabric.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 bits) for buffering, FIFOs, and embedded data storage.
• I/O and Gate Count  502 user I/O pins and approximately 1,400,000 gates support complex interfacing and moderate system integration.
• Power  Core supply voltage specified at 1.14 V to 1.26 V to match system power-rail requirements.
• Package and Mounting  676-BGA package (supplier package: 676-FBGA, 27×27) in a surface-mount form factor for dense PCB layouts.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to support lead-free manufacturing processes.

Unique Advantages

• High programmable density: 25,344 logic elements enable implementation of sizable custom logic functions without external ASICs, reducing overall system complexity.
• Substantial on-chip RAM: Approximately 0.59 Mbits of embedded memory supports data buffering and local storage, minimizing external memory dependencies.
• Extensive I/O capability: 502 I/O pins allow broad signal interfacing options for mixed-signal peripherals and multi-channel designs.
• Compact, manufacturable package: 676-BGA (676-FBGA, 27×27) surface-mount package suits high-density PCBs while preserving routing and thermal characteristics.
• Defined commercial operating range: Rated for 0 °C to 85 °C, suitable for standard commercial electronics environments.
• RoHS compliant: Meets environmental requirements for lead-free assembly and worldwide regulatory preferences.

Why Choose XC3S1400A-5FGG676C?

The XC3S1400A-5FGG676C positions itself as a robust, mid-range Spartan®-3A FPGA option for designs that need a balance of logic capacity, embedded RAM, and a large I/O complement in a compact BGA package. Its specifications make it suitable for applications requiring moderate programmable logic density and significant on-chip memory while adhering to commercial temperature and RoHS-compliance constraints.

Backed by AMD as the manufacturer, this device is appropriate for teams and projects targeting scalable, reconfigurable hardware implementations where on-board integration and I/O density are important considerations.

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