XC3S1400AN-4FG484C

The XC3S1400AN-4FG484C is a Spartan®-3AN field programmable gate array (FPGA) from AMD, supplied in a 484-ball BGA package. It provides a balanced combination of programmable logic, on-chip memory and I/O resources suitable for a wide range of commercial electronic designs.

With 25,344 logic elements, approximately 0.59 Mbits of embedded memory, 372 user I/O pins and an equivalent of about 1,400,000 gates, this device targets designs that require substantial integration in a surface-mount 484-BBGA footprint while operating from a 1.14 V to 1.26 V supply over a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic capacity  25,344 logic elements provide the programmable resources for implementing complex, custom digital functions and state machines.
• Configurable logic blocks (CLBs)  2816 CLBs available for structured logic partitioning and hierarchical design.
• Embedded memory  Approximately 0.59 Mbits (589,824 bits) of on-chip RAM for buffering, FIFOs and local storage.
• I/O resources  372 user I/O pins support parallel interfaces, control signals and external device connections.
• Gate equivalent  About 1,400,000 equivalent gates for estimating integration density and system partitioning.
• Power and supply  Core supply voltage range of 1.14 V to 1.26 V for the device core power domain.
• Package and mounting  484-BBGA package (supplier package: 484-FBGA, 23×23 mm) optimized for surface-mount assembly.
• Operating range and compliance  Commercial grade device rated for 0 °C to 85 °C and RoHS compliant.

Typical Applications

• Custom logic and control  Implement application-specific state machines, control logic and protocol handlers using the device’s 25,344 logic elements.
• High-pin-count interfacing  Leverage 372 I/O pins for multi-channel sensor interfaces, peripheral bridging or parallel data paths.
• On-chip buffering and FIFOs  Use the approximately 0.59 Mbits of embedded memory for data buffering, temporary storage and stream handling.
• Compact commercial systems  Surface-mount 484-BBGA package enables high-density board designs for commercial electronics within the 0 °C–85 °C operating range.

Unique Advantages

• High integration in a single device: Consolidates logic, memory and I/O capability—reducing component count and simplifying PCB routing.
• Substantial on-chip RAM: Approximately 0.59 Mbits of embedded memory supports local buffering and reduces dependence on external memory in many designs.
• Extensive I/O availability: 372 user I/Os accommodate complex external interfaces without additional I/O expansion.
• Predictable supply and thermal envelope: Core supply range of 1.14 V–1.26 V and commercial temperature rating align the device to standard board-level power and thermal designs.
• RoHS compliant commercial part: Meets RoHS requirements for environmentally conscious manufacturing and procurement.
• Compact BBGA footprint: 484-ball package with a 23×23 mm supplier footprint supports dense system integration and surface-mount assembly.

Why Choose XC3S1400AN-4FG484C?

The XC3S1400AN-4FG484C is positioned for commercial designs that require a balance of programmable logic capacity, on-chip memory and high I/O density in a compact surface-mount package. Its combination of 25,344 logic elements, approximately 0.59 Mbits of embedded RAM and 372 I/O pins makes it appropriate for systems that need substantial integration without relying entirely on external components.

Backed by AMD as the manufacturer, this FPGA provides a clear resource profile for project planning and long-term deployment in commercial applications that operate within the provided supply and temperature ranges.

Request a quote or submit an inquiry for XC3S1400AN-4FG484C to obtain pricing and availability for your design needs.