XC3S1400AN-4FG676C

The XC3S1400AN-4FG676C is a Spartan®-3AN field programmable gate array (FPGA) from AMD designed for configurable digital logic applications. It provides substantial on-chip resources and a high I/O count in a compact 676-BGA package for commercial-grade designs.

With 25,344 logic elements, approximately 0.59 Mbits of embedded memory and 502 user I/O pins, this device targets designs that require significant logic capacity and dense external interfacing while operating within standard commercial temperature and supply ranges.

Key Features

• Core Logic  Approximately 25,344 logic elements and 1,400,000 equivalent gates provide a sizable fabric for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 bits) to support buffering, lookup tables, and data storage close to logic.
• I/O Capacity  502 user I/O pins enable dense connectivity to external devices, sensors, and buses.
• Package and Mounting  676-BGA package (supplier package: 676-FBGA, 27×27) with surface-mount mounting type for compact PCB integration.
• Power  Core supply voltage specified at 1.14 V to 1.26 V for device operation.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C to match standard commercial deployments.
• Compliance  RoHS compliant, supporting lead-free manufacturing and regulatory requirements.

Typical Applications

• Configurable digital logic  Use the FPGA fabric and embedded memory to implement custom digital functions and control logic in systems requiring reconfigurable hardware.
• Interface bridging and I/O expansion  Leverage the 502 I/O pins to bridge multiple peripherals or expand system connectivity without large external glue logic.
• Prototyping and development platforms  Deploy the device where substantial logic resources and on-chip RAM are needed for hardware validation and iterative design.

Unique Advantages

• High logic density: 25,344 logic elements enable substantial functionality in a single device, reducing the need for multiple discrete components.
• Significant on-chip RAM: Approximately 0.59 Mbits of embedded memory supports local buffering and state storage for performance-sensitive designs.
• Extensive I/O: 502 I/O pins offer flexible and dense external interfacing options for complex systems.
• Compact packaging: 676-BGA (27×27) provides a space-efficient footprint for board-level integration.
• Commercial temperature rating: 0 °C to 85 °C makes the device suitable for standard commercial environments.
• RoHS compliant: Supports lead-free manufacturing and regulatory compliance for many global markets.

Why Choose XC3S1400AN-4FG676C?

The XC3S1400AN-4FG676C combines a large logic fabric with substantial embedded memory and a high I/O count in a compact 676-BGA surface-mount package, making it a practical choice for commercial designs that require configurable digital logic and dense interfacing. Its defined core voltage range and commercial temperature rating provide clear operational boundaries for system design and integration.

This AMD Spartan®-3AN FPGA is suitable for engineers and teams building hardware that needs reconfigurable logic capacity, moderate on-chip memory, and broad I/O connectivity while adhering to RoHS requirements.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the XC3S1400AN-4FG676C.